Products  About us   Prices  Order  Search  Potential authors  Links  Contacts  Mailing

     Books   Manuals   Reports   Videos   CD-ROMs

Code: EP01

Contents of this page:

Description
Some Worldwide Reviews
About the author

Description

The book ‘Soldering in Electronics’ has been written to cover soldering as a technique for mass production of electronic connection, although many items treated will be useful for other branches of soldering technology.

It is explained that reliable soldering can only be achieved if soldering is treated as a coherent system, all separate aspects of which are to be well prepared, often long before the actual moment of the soldering operation. This way of thinking has many implications for the other chapters, such as those on solderable coatings, solderability assessment, and joint design.

The book provides a combination of background knowledge and information for practice. In doing so it helps to clarify many points of basic discussion among soldering experts, such as wetting and dewetting, thermal influences, solderability and methods of its assessment, metallurgy of alloys and coatings, and process conditions. On the other hand it contains a wealth of detailed and practical information on soldering alloys, fluxes, coatings, soldering methods, pattern design, joint reliability and criteria for joint inspection. A separate chapter is devoted to the thermal aspects of soldering, a subject that is seldom discussed in literature despite its utmost importance for soldering.

In the second edition of this book (contrasting with the first edition) extensive attention is given to surface mounting technology, with subjects like component metallisations, dimension of footprints of leadless and multi-lead packages, application of solder paste and adhesive, adapted wave soldering and reflow soldering techniques, such as infra-red soldering, vapour phase soldering, resistance soldering and laser soldering.

Specific effects of surface mounting, such as misplacing of components, solder leaching, solder wicking, floating and drawbridging of components are dealt with in detail.

It is the combination of theory and practice which makes the book indispensable to a broad group of readers with a responsibility for electronics manufacturing, both in R & D and production, such as design engineers, process engineers, production engineers, quality engineers, metallurgists and chemists.

Some Worldwide Reviews

1st Edition

"It contains a wealth of detailed and practical information ... The book can be well recommended to all of those with any interest in the soldering of electronic assemblies."

IEEE (USA)

"This book is a ‘bible’ for all those who are engaged in electronics production and cannot be recommended too highly."

Microelectronics and Reliability (UK)

2nd Edition

"This is an expanded, up-dated version of the First Edition (pp. 470) published in 1984. It is sub-titled ‘A comprehensive Treatise on Soldering Technology for surface Mounting and Through-hole Techniques’, and it meets fully with expectations.

With his professional experience so closely involved with the subject matter, as leading technologist at Philips, Eindhoven, Mr Klein Wassink is able to offer advice and interpretation based on his unique experience. I found the work to represent a mine of useful information, containing perhaps on this occasion somewhat less of his personal interpretation of some of the soldering phenomena, and counterbalanced by useful descriptions of each of the main researches referenced. It is a worthy tribute to the scholarship of the author who is to be congratulated on having assembled this improved reference book in record time.

The work is an absolute ‘must’ for all technicians involved in soldering, from research and development through to production line-management. The author has assembled a first class ‘encyclopaedia’ of our technology."

Circuit World (UK)

"The recent appearance of the second, enlarged edition of Klein Wassink’s book on Soldering in Electronics, only 5 years after the first printing, bears witness to several facts: above all to the undiminished pace of growth and innovation in the field of soldering and surface mounting technology, but no less to the author’s industry and his commitment to the cause of soldering.

The book has grown, from 434 to 693 pages of text, and from 17 pages of references to 49. This, altogether with the bibliography makes the book into a veritable encyclopedia of soldering knowledge.

To sum up: since the first edition of this book was reviewed by this reviewer (Circuit World, Vol. 10, No. 4, Summer 1984), a great many important things have happened in the field of soldering electronics assemblies. The best place to find out about them, presented comprehensively and authoritatively, is this present volume."

Soldering and Surface Mount Technology (UK)

"The result of this expertise is a truly remarkable work of reference.

As a reviewer I found this book fascinating. There was virtually no topic that I could think of which was not addressed somewhere. I must recommend it strongly to anyone wishing to have a reference work relating to soldering, surface mount technology and electronics manufacturing generally."

Hybrid Circuits (UK)

About the author

The Author (family name Klein Wassink) was born in the Netherlands in 1933. He studied metallurgy at the Technical University of Delft, Holland, where he received his degree in 1962. Joining the Research Laboratories of Philips at Eindhoven, he undertook work in the fields of metals and ceramic technology, in which areas he has several publications to his credit.

In 1975 Mr Klein Wassink left research to become leader of the soft-soldering group at the Centre For Manufacturing Technology of Philips, Eindhoven. This group worked for many years on subjects related to mechanised soldering techniques as applied in electronic equipment production, including the soldering of all types of printed boards and hybrid circuit substrates. In 1985 this group was enlarged and transformed into the Philips SMD-Technology Centre, where the Author is now responsible for development of technology.

Besides guiding experimental work on soldering, the Author is chairman of several consultative and standardisation committees within his company and participates in similar work at an international level.

Throughout the years of working on soldering technology he has written many original publications and has given numerous presentations at seminars, conferences and workshops.