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Code: EP05 Contents of this page:Description DescriptionThe advantages of surface mounting electronic components, rather than insertion mounting leaded components, are a reduced board size and weight, an increased performance and reliability and a fully automated, rationalised production. The purpose of this book is to give the reader a better scientific understanding of the physical mechanisms involved in the implementation of this novel technology. The aim is that, through a scientific perception, both the manufacturing efficiency and the product reliability will benefit from the revolutionary step of surface mounting, in offering the electronic assembly industry solutions to the new problems that are firmly based, technically and scientifically. This book presents a full and rationalised coverage of all the major aspects of surface mounting technology, giving the underlying principles involved which in turn offer guidelines for design, assembly, inspection and test. The scientific underpinning of SMT is illustrated using existing components, substrates and soldering techniques, but in a format such that the guidelines can be readily extended for continued use as the technology inevitably progresses. Some Worldwide Reviews"This is the most difficult book I have ever had in my hands to review. Why? A reviewer has for task to try and point out as impartially as possible the strong and weak points of the work in question. In this case, critical as I am known to be, the strong points are easy to find, but I have had really to work to find any weak ones! Of course, this does not necessarily mean that I agree with every word in it, there is still room for opinions to be expressed. In short, if this book does not become the ‘standard’ reference work on the subject for the next few years, I’ll eat my hat (if I had one!). Finally, a few words of a general nature. At first, I was daunted by the fact that the references were in a block at the end of the book, rather than at the end of each chapter. After reading a few chapters, I had become used to the idea. By the end of the book, I found it was indeed preferable. This reference list is very complete and shows that Dr Lea has not only done his homework, but, as he admits in the preface, he has drawn heavily on the publications of third parties, naming a few of them. The reference list is also completed by a list of the authors of the references in alphabetical order. As in all the Electrochemical Publications books, there is an excellent index. Also as in all of them, the quality of printing, paper, typesetting, layout and binding is irreproachable. In short, this book is a must for all those who wish to know more about any aspect of SMT and is an excellent example of how to write and present an ‘applied science’ treatise. Thoroughly recommended!" Hybrid Circuits (UK)
"The author is to be congratulated on his masterly, scientific approach in assisting to resolve the many problems in surface mount and general soldering which until very recently would have been regarded as a black art. Dr Lea’s grasp of the subject in the context of his physico-mathematical understanding of the processes involved in soldering is expressed with exceptional lucidity. The style of presentation is particularly appealing to the reviewer who was able to relax in reading long sections of the book at a time." Circuit World (UK) About the authorAfter gaining a first class Honours BSc degree in physics and a PhD in surface physics, both from the University of Southampton, Colin Lea spent two years on the faculty of the University of Chicago before joining the National Physical Laboratory in 1971. Within the Surfaces and Interfaces Group, Dr Lea heads the research in the science of metal wetting. In 1980 he set up the NPL Soldering Science and Technology Club which now comprises well over 100 companies associated with all aspects of the electronic assembly industry. The success of this Club has led to the inauguration of the Surface Mount Club at NPL. Dr Lea is a Fellow of the Institute of Physics and a Member of the Institute of Metals. Table of Contents
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