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Code: EP06 Contents of this page:Description DescriptionThis book is a practical guide for all persons who are in any way concerned with cleaning or contamination control of either components or assembled circuits. It is also useful to those specifying components and, in particular, printed circuits. It equally covers the theoretical side to a sufficient extent to allow the average engineer or technician who is not a specialist in the field to understand the mechanisms involved in contamination and cleaning. As a reference book, the text is divided into seven parts, logically divided into some thirty chapters illustrated by photographs, line drawings, graphs and tables. Each chapter has its own reference list. The introductory section comprises an historical background to cleaning in the electronics industry, a very complete chapter of definitions of all the terms employed and in the particular context, a short chapter on units employed, a theoretical treatise on the mechanics, physics and chemistry of cleaning (in simple terms) and one on the cost of cleaning. The second part comprises come seven chapters cataloguing the diverse ways that contamination can occur in the electronics industry, whereas the third part describes, over three chapters, what effects contamination can have during the various manufacturing processes of components and assemblies and over the whole of their subsequent lives. Part 4 will be considered as being the most important by some production engineers because its four chapters describe all the currently used methods of cleaning and flux removal for the small, medium or large user with considerable detail on the products usually employed. The fifth section deals with ionic contamination control. The first two chapters discuss respectively the American military specifications and the new British DEF standards. The third one gives a general view of the different instruments commercially available for measuring or detecting ionic contamination. The last chapter of this section gives an insight into some aspects of the theory of ionic contamination measurement and the solutions used for it. The next part treats the detection and measurement of contamination by other methods, with particular emphasis on non-ionic contaminants. Insulation resistance measurement is discussed in a separate chapter of this section. The last part, divided into three chapters, relates to the particular problems imposed by the use of surface mounted components and solder creams and pastes. It is felt that this book will become a valuable reference work for the bookshelves of all companies involved in any aspect of electronics, particularly component, printed or hybrid circuit manufacturers or assemblers. Some Worldwide Reviews"The publishers are to be complemented in adding to their range of reference books for our industry one which will become cleaning in process and who wish to know more of the reasons for the methods which are being recommended. It is the sort of book which you can pick up and read a chapter in isolation and feel that you have read an article of merit. For those of us who know Brian Ellis well, we can not only read but we can actually see him expounding his ideas in his own inimitable style. A book well worth having on the reference bookshelf." Circuit World (UK) About the authorBrian N.Ellis is an electronics engineer, whose general and academic education took place in Edinburgh. After completing military service in 1954 he was employed by a number of companies in the UK before moving to Switzerland in 1963. By a gradual process he has gravitated from pure electronics towards electronics packaging, notably in soldering technology and printed circuit manufacture. He was instrumental in introducing the first production line using wave soldering with water soluble fluxes in Switzerland in the period 1964 to 1967. On the basis of some original work towards the improvement of the solderability of printed circuits, he was responsible for building up what was, in the late 1960s, the most technically evolved PCB manufacturing plant in Switzerland and for making this a viable operation. In 1974, he founded his own company, Protonique SA, where his realisation of the potential of applying the computer to the analysis of contamination measurement, led to successful development which rapidly promoted his Company to the forefront in this area of technology. Since the foundation of Protonique, it was realised that the electronics assembly industry was responsible for much pollution of the air, water and the soil. This subject has been at the forefront of Brian Ellis' thinking since the 1970s and he has contributed much to this theme. Other professional activities have included working on a Commission (which he chaired from 1975 to 1980) for elaborating the Recommendations "Circuits Imprimés" of the Groupement de l'électronique de Suisse occidentale (GESO). In 1989, he was appointed the official Swiss delegate to the United Nations Environment Programme (UNEP) Solvents, Coatings and Adhesives Technical Options Committee (STOC): this is instrumental to the Parties to the Montreal Protocol towards the phasing out of ozone-depleting solvents. He is a member of the Steering Group and Chairman of the Electronics Working Group of the STOC. He has sat on a number of IPC Committees and was vice-chairman of the Aqueous Cleaning Working Group. He also sits on an ISO Committee Working Group studying Surface Insulation Resistance (SIR). Mr Ellis has also published nearly two hundred technical papers, many of which have been presented at conferences throughout the world. Amongst the awards presented to Brian Ellis, there are two United Nations Environment Programme Certificates and the United States Environmental Protection Agency honoured him in 1994 with the Stratospheric Ozone Protection Award for Individual Leadership in CFC Solvent Elimination "in recognition of exceptional contributions to global environmental protection". A Chartered Engineer, Mr Ellis is also a Member of the Institute of Electrical Engineers, where he has also presented papers to the Swiss Chapter. Table of Contents
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