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Code: EP08

Contents of this page:

Description
About the Editor

Description

Surface Mounted Assembly Technology has been born out of a marriage of Hybrid Thin and Thick Film techniques and Printed Circuit Board Assemblies. The result is a very cost-effective means for miniaturisation, plus greater design freedom than before. These attractive properties have resulted in a very fast exploitation of Surface Mounted Assemblies over a very broad spectrum of applications from military to consumer. It is a subject that needs to be well understood by those working in Electronics in both R & D and production, such as system and circuit design engineers, technologists, process and production engineers.

This book has been written by a team of industrial-based engineers, technologists and scientists, each of whom is an expert in his own field, who combine theory with many years of practical experience. The objective of the authors has been to provide a logical, full, and yet concise, coverage of all the major aspects of the application of surface mounted technology. It is hoped that, while emphasising the practical aspects for the benefit of those already working in industry, it will be a useful introduction for those studying to become professionally qualified. References and/or a bibliography are provided at the end of each chapter to enable the reader to further extend and deepen his understanding on specific aspects of the subject.

About the Editor

After gaining his BSc in Physics and Mathematics at Leicester University, and completing National Service in the Royal Signals, John Pawling undertook a two-year graduate training scheme with Mullard. In 1957 he joined the Mullard Application Laboratories where he contributed to the early work on the use of serniconductors in audio, radio, television, DC converters and oscilloscopes. In 1967 he left to help in the management of a new activity to design and manufacture electronic sub-assemblies for a wide spread of application areas and using a variety of technologies including both Thin and Thick Filrns, and Printed Circuit Boards. Mr Pawling has been instrumental from 1980 onwards in the setting up of a Surface Mounted Assemblies activity at Mullard Mitcham. He is a Fellow of the Institution of Electronic and Radio Engineers.