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EP06 view

GOLD PLATING TECHNOLOGY

by F. H. REID & W. GOLDIE

Pages--630+xx; Tables--86; Figures--150; References--934; Size--21 x 15 cm.
ISBN 0 901150 02 9

Code: EP11

Contents of this page:

Some Worldwide Reviews
Table of Contents

Some Worldwide Reviews

"The contributors’ credits for this, the first comprehensive volume on gold plating, reads like a "Who’s Who" of precious metal deposition....Anyone who has had to search through the literature to find data on solderability, for example, a very important aspect connected with gold plating, will appreciate the convenience of having it available in one volume where, if what is included does not meet his total need for information, it at least directs him to the sources of more. This alone makes the book a very worthwhile investment. And, the ideas which present themselves in the chapters on applications could suggest further uses offering the possibility of significant economies. When dealing with a metal as costly as gold these days, it may take only a little pointer to open the way to save thousands of dollars."

Metal Finishing (USA)

 

"There does not appear to be any aspect of cleaning techniques, plating solution, methods of deposition, physical properties, deposit evaluation, and decorative and industrial applications of gold deposits that has been overlooked in this extremely worthwhile addition to the technical literature on gold plating. To paraphrase the title of a recent best seller, it seems that an appropriate alternative title might well be ‘Everything You Wanted to Know About Gold Plating but Were Afraid to Ask’. The Editors as well as the 24 individual contributors are, without exception, to be commended for their comprehensive treatment of the multitude of subjects contained within the covers of this book.

The section which deals with the subject of testing is but one good example of the thoroughness with which all areas of interest are treated. It is a credit to all those individuals involved that there is now available a book on gold which is so complete in its coverage of the subject matter that it should now be possible to find a needed answer concerning gold in a single volume, thereby saving all of us countless hours, sometimes fruitless ones, of searching through seemingly endless journals and periodicals for answers to our questions .... There is little doubt that this book will find wide acceptance and be referred to frequently by anyone who is interested or involved in the deposition, use or evaluation of gold deposits."

Plating (USA)

 

"This book contains a wealth of data and guidelines not available elsewhere in a single source. It can be highly recommended for our reading audience."

IEEE (USA)

 

"..embraces the work of 24 world authorities in the field of Gold Plating, and must rank as a unique presentation. Unlike many major technical works, the subject is treated in a manner which is both interesting and informative..."

Electronics Weekly (UK)

 

"Twenty four of the World’s leading experts have been persuaded to join together to produce what must surely be the definitive work on this subject."

Design Engineering (UK)

 

"This is a superb book in which a wealth of information written by leading specialists has been gathered into a very lucid form by the editors"..."It is extremely difficult to fault this publication in any manner."

Metals (Australia)

Table of Contents

PART 1 — INTRODUCTION

Chapter

1 Historical Background

2 Why Use Gold?

PART 2 — ELECTROLYTES

3 Introduction

4 Alkaline Cyanide Electrolytes

5 Neutral Electrolytes

6 Acid Electrolytes

7 Non-Cyanide Electrolytes

8 Electrolyte Parameters

9 Process Characteristics

10 Immersion Solutions

11 Electroless Solutions

PART 3 — TECHNIQUES

12 Pretreatment

13 Vat Plating

14 Barrel Plating

Chapter

15 Aerosol Deposition

16 Brush Plating

17 Miscellaneous Techniques

Turbo Jet

Selective Plating

18 Post-Treatment

PART 4 — PROPERTIES

19 Solderability

20 Weldability

21 Wear, Friction and Lubrication

22 Contact Properties

23 Porosity

24 Density

PART 5 — TESTING

25 Solderability

26 Contact Resistance

27 Porosity

Chapter

28 Thickness

29 Hardness

30 Stress

31 Ductility

32 Adhesion

33 Analysis

34 Quality Control

PART 6 — APPLICATIONS

35 Printed Circuits

36 Connectors

37 Semiconductors and Microelectronic Devices

38 Reed Switches

39 Space Applications

40 Electroforming and Heavy Deposits

41 Watchcase Manufacture

42 Jewellery

APPENDIX Specifications

 

 

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 Page last revised 11.02.05

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