HANDBOOK OF MICROELECTRONICS PACKAGING AND INTERCONNECTION TECHNOLOGIES

by N. SINNADURAI

Pages--271+xii; Tables--32; Figures--220; References--143; Size--23 x 15 cm.
ISBN 0 901150 19 3

Evolution of Packaging and Encapsulation of Semiconductor Chips

N. Sinnadurai

1.1 Introduction

1.2 Package Developments Through to the Eighties

1.2.1 Early Packages

1.2.2 Package Complexity Growth (The Advent of the Dual-in-line Package)

1.2.3 CerDIP, Plastic DIP and Plastic Packaging

1.2.4 The ‘Hermetic’ Chip

1.2.4.1 Passivations

1.2.4.2 Metallisations

1.2.5 Effective Plastic Encapsulation

1.2.6 Surface Cleanliness

1.3 Trends Towards Miniaturisation

1.3.1 On-chip Techniques

1.3.2 Historical Cost Trends

CHAPTER TWO

Thin-film Technology

A. Van Calster

2.1 Introduction

2.2 Deposition Technology

2.2.1 Thermal Evaporation

2.2.2 Cathodic Sputtering

2.2.3 Plasma Enhanced Chemical Vapour Deposition

2.2.4 Anodic Oxidation

2.2.5 Substrate Types and Cleaning

2.2.6 Thickness Measurements

2.3 Physics of Thin Films

2.3.1 Nucleation and Growth

2.3.2 Mechanical Stress and Adhesion

2.3.3 Transport Properties

2.4 Pattern Definition

2.4.1 Metal Shadow Masks

2.5 Thin-film Devices

2.5.1 Conductors

2.5.2 Dielectric Films

2.5.3 Resistors

2.5.4 RC Networks

2.5.5 Thin-film Transistors

2.5.6 Thin-film Solar Cells

2.5.7 Optical Coatings

2.6 Concluding Remarks

CHAPTER THREE

Thick-film and Associated Technologies

G. Björklund

3.1 Introduction

3.2 Thick-film Processes and Materials

3.3 Thick-film Elements

3.3.1 Conductors

3.3.2 Capacitors

3.3.3 Resistors

3.3.3.1 Thick-film Resistors — Range and Adjustments

3.4 Passive Chip Components

3.4.1 Ceramic Chip Capacitors

3.4.2 Tantalum Chip Capacitors

3.4.3 Chip Resistors

3.4.4 Inductors

3.5 Conclusions

CHAPTER FOUR

Thick-film Hybrids and Applications

B. Björklund

4.1 Introduction

4.2 Hybrid Technology

4.2.1 Bare Chip and Wire Technique

4.2.1.1 Epoxy Attachment

4.2.1.2 Encapsulation

4.2.2 Solder Assembly

4.2.2.1 Add-on Components

4.2.2.2 Soldering Process

4.2.3 Active Trimming

4.2.4 Large-scale Integration

4.3 Circuit Project Planning

4.4 Circuit Development

4.4.1 Circuit Design

4.4.1.1 Basic Data for Measurements and Documentation

4.4.2 Prototype Manufacture and Evaluation

4.4.3 Volume Production

4.5.1 Electret Transmission Modules (ETM)

4.5.2 Active Filters

4.5.3 Attenuator Networks

4.5.4 Line Interface Circuits

4.5.5 LSI Hybrid Modules (On Multilayer Substrates)

4.5.6 Special Modules for Optoelectronics

4.6 Conclusions

CHAPTER FIVE

High Density Packaging of Chips and Subcircuits

N. Sinnadurai

5.1 Introduction

5.2 Packaging of Bare-chip-and-wire (BCW) Hybrid Microcircuits

5.2.1 Hermetic Packaging of BCW Hybrids

5.2.2 Problems of Bare-chip Hybrids

5.3 Micropackaging (for Surface-mounting)

5.3.1 The Case for Micropackaging

5.3.2 Low-cost, High Reliability Encapsulation

5.3.2.1 Plastic Coatings

5.3.2.2 The ‘EPIC’ (PCB) Chip Carrier

5.3.3 Post-moulded Chip Carriers

5.3.4 Small Outline (SO) Packages

5.3.5 Reliability Findings with SO and EPIC Packaging

5.3.6 Grid Arrays

5.3.7 Tape Automated Bonding (TAB)

5.3.8 Relative Merits of Micropackaging Options

5.3.9 Forecast Growth and Penetration of Micropackages

5.4 Cost Effective Packaging for Hybrids Employing Micropackaged ICs

5.5 Life Cycle Costs and Benefits from the Trends in Electronic Packaging

CHAPTER SIX

Reliability of Microelectronics (Packaging and Interconnection)

N. Sinnadurai

6.1 Introduction

6.2 Reliability Behaviour and Failure Distributions

6.2.1 The Bathtub Curve and its Reliability Regimes

6.2.2 Reliability Functions

6.2.2.1 The Exponential Function for Constant Failure Rates

6.2.2.2 The Log-normal Function for Wear-out Failures

6.2.3 Reliability Assessment

6.2.3.1 Random Failures

6.2.3.2 Wear-out Failures

6.3 Accelerated Ageing

6.3.1 Accelerated Ageing of Semiconductor Components

6.3.1.1 Accelerated Ageing by Thermal Overstress

6.3.1.2 Accelerated Ageing by Electrical Overstress

6.3.1.3 Accelerated Ageing by Damp Heat Overstress

6.3.1.4 Accelerated Factors for Thermal and Humidity Stress

6.3.2 Accelerated Ageing of Thick Films

6.3.2.1 Expression for Acceleration

6.3.2.2 Ageing Behaviour of Thick-film Resistors

6.3.2.3 Accelerated Tests of Thick-film conductors

6.3.3 Reliability Assessments of Active Hybrids

6.4 Screening For Reliability (Reliability Indicators)

6.4.1 Hermeticity and Moisture Ingress

6.4.2 Properties of the Encapsulating Plastics Materials

6.4.3 Properties of the Adhesives

6.4.4 Other Requirements for High Reliability

CHAPTER SEVEN

Printed Circuit Boards

D. J. Small

7.1 Introduction

7.2 Types of Printed Circuit Board

7.2.1 Conventional

7.2.2 Plated-through Hole

7.2.3 Multilayer

7.2.4 Flexibles

7.3 Artwork

7.3.1 Design Methods

7.3.1.2 CAD

7.3.2 Design Criteria

7.3.3 Preparation of Phototools

7.4 Technologies

7.4.1 Subtractive

7.4.2 Semi-additive

7.5 Laminates

7.5.1 Reinforcements

7.5.1.1 Glass

7.5.1.2 Kevlar

7.6.1.3 Quartz

7.5.2 Resins

7.5.2.1 Epoxy

7.5.2.2 Polyimide

7.5.2.3 Others

7.6 Processes

7.6.1 Drilling

7.6.2 Electroless Deposition

7.6.3 Photoprinting

7.6.4 Pattern Plating

7.6.5 Stripping

7.6.6 Etching

7.6.7 Gold Plating

7.6.8 Solder Finishes

7.6.9 Solder Resist and Component Identification Application

7.6.10 Profiling

7.6.11 Cleaning

7.6.12 Multilayer Lamination

7.6.13 Etchback

7.7 Wear-out Mechanisms

CHAPTER EIGHT

Advanced PCBs and Alternative Substrates

D. J. Small and N. Sinnadurai

8.1 Introduction

8.2 Advanced Techniques

8.2.1 Laser Imaging

8.2.2 Fully Additive Processing

8.2.3 Mass Lamination/Fine-Line

8.2.4 Palladium-nickel

8.2.5 Laser Drilling

8.3 Alternative Substrates

8.3.1 Lampac

8.3.2 Pillar-plated Substrates

8.3.3 Metal-cored Boards and Inorganic Substrates

8.4 Prototyping Techniques

8.4.1 Multiwire

8.4.2 Solder-wrap

CHAPTER NINE

Thermal Aspects of Microelectronics Packaging and Interconnection

N. Sinnadurai

9.1 Introduction

9.2 Temperature-dependent Effects

9.2.1 Reliability

9.2.2 Thermal Mismatch

9.2.3 Temperature-sensitive Parameters of Microelectronic Components

9.2.3.1 Semiconductor Components

9.2.3.2 Passive Components

9.3 Mechanisms of Heat Transfer

9.3.1 Conduction

9.3.2 Convection

9.3.3 Radiation

9.3.4 Relative Magnitudes of the Heat Transfer Mechanisms

9.4 Practical Aspects of Conductive and Convective Heat Transfer

9.4.1 Practical Aspects of Conductive Heat Transfer

9.4.1.1 Thermal Conductivity

9.4.1.2 Thermal Resistance for Steady-state One-dimensional Heat Flow

9.4.1.3 Thermal Resistance for Steady-state Three-dimensional Heat Flow

9.4.1.3.1 PES Substrates with Isolated Heat Sources

9.4.1.3.2 Alumina Substrates with Isolated Heat Sources

9.4.1.3.3 Alumina Substrates with Distributed Heat Sources

9.4.1.3.4 Integrated Circuits in Chip Carriers

9.4.1.3.5 Series Heat Flow from Chip Carrier via Alternative Substrates

9.4.1.4 Thermal Resistance for Transient Heat Flow

9.4.1.4.1 Transients due to Power Turn-off

9.4.1.4.2 Thermal Transient Due to Power Pulse

9.4.2 Practical Aspects of Convective Heat Transfer

9.4.2.1 Fins

9.4.2.2 Convection Moduli

9.4.3 Other Techniques for Cooling Microelectronics packages

9.4.3.1 Heat Pipes in Microelectronics

9.4.3.2 Microminiature Refrigeration in Microelectronic Packaging

9.5 Concluding Remarks