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Code - EP13 DescriptionNow completely revised, the 2nd Edition of the Handbook of Thick Film Technology contains around 75% new material. Thick Film Technology has been with us for many years, and became popular the 1970's, and has been in continuous use ever since. The difference between Thick and Thin Film is not so much the thickness of the film, but the method of application; Thick Film is screen-printed using a mesh and squeegee technique. In 1976 we published The Handbook of Thick Film Technology by Holmes and Loasby, which rapidly became the standard industry text on the subject. In the rapidly changing world of microelectronics few things last for long, but despite publishing our book Thick-Film Technology and Applications in 1999, the original 25-year old handbook still continued to sell. The second edition has now been written, and we no longer offer the first. Remarkably, we still regularly get sales enquiries for the 25-year old first edition. Unlike Thin Film, it seems that quality information is very hard to find on Thick Film, and The Handbook of Thick Film is the book that gets recommended. The second edition is completely revised.
2nd Edition - Chapters and Authors Chapter 1 - Development of Thick Film Technology by G. Holmes and P.J Loasby (revised by Keith Pitt) Chapter 2 - Thick Film Materials and Processes by K. Pitt and J. Savage. Chapter 3 - Printing Thick Film Hybrids by A. Hobby Chapter 4 - Substrates by W.A. Crossland and L. Hailes (revised by K. Pitt) Chapter 5 - Conductor Materials - Q. Reynolds Chapter 6 - Characteristics of Thick Film Dielectrics by S.
Achmatowicz and M. Jakubowska Chapter 7 - The Structure and Composition of Thick Film Resistors by K. Pitt Chapter 8 - Characteristics of Resistors by S. Achmatowicz and M. Jakubowska Chapter 9 - Introduction to Thick Film Design and Layout by K. Pitt Chapter 10 - Thick Films at High Frequencies by K. Pitt Chapter 11 - Thermal Design Aspects by D. J. Dean Chapter 12 - The Adjustment of Thick Film Components and Circuits S. Achmatowicz and M. Jakubowska Chapter 13 - Circuit Devices and Assembly by M. V. Coleman Chapter 14 - Packaging of Hybrid Microcircuits by P. M Bartholomew Chapter 15 - Reliability And Failure Mechanisms by K. Pitt Chapter 16 - The Future Development of the Technology by K. Pitt
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