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Code: EP14

Contents of this page:

Description
Some Worldwide Reviews

Description

The need for the thermal design of electronic systems is well established but rarely given the attention it deserves. This is partly attributable to the mystique that has built up around thermal predictions and the tradition that thermal calculations are only for the academic mathematician. This book aims to overcome these barriers and enable the electronic engineer to tackle with confidence his own thermal design. To deal with thermally caused failures it is necessary to know where the large temperature differences are and also which of these can be economically reduced. This text concentrates on the part of electronic systems which generally contributes most to the overall temperature and is also frequently the most economical to tackle—that neglected area close to the heat sources, namely the circuit boards and packages.

The book presents the electronic designer with the expertise and a tool kit of temperature prediction methods with which he will be able to tackle his own particular problems. Mathematics are reduced to a level where all the formulae can be obtained using a typical programmable pocket calculator.

For the electronic engineer inexperienced in thermal design, the author has made extensive use of analogues to aid in developing an understanding of heat flow. Improvements in design involving varying degrees of calculation are described.

With the availability of suites of computer programmes for quick and easy design of equipment, the author warns that much is in danger of being lost, such as the understanding of the real thermal processes that comes with experience in traditional ‘at the desk’ design methods. Engineers new to thermal problems need to develop this appreciation of heat flow before blindly accepting computer predictions. Those more experienced will be better able to assess critically the meaning of the computer’s output.

The book is divided into six parts, two appendices, and a mathematical supplement. Throughout, examples used are typical and demonstrate a whole range of temperature prediction methods. With practice the electronic engineer who implements the techniques described should be able to produce designs thermally close to optimum.

In the broader field of general heat flow, it is believed that no other book exists dealing exclusively with small heat sources. Many of the procedures outlined are applicable to areas other than electronics where heat is generated within relatively small regions.

Some Worldwide Reviews

"Every aspect of heat dissipation and distribution is dealt with in this most comprehensive book on the subject ... For the experienced thermal designer, the book contains many novel temperature production techniques not previously published. These, added to the earlier methods of the author and others and restated in the book create a comprehensive toolkit for temperature production."

Microelectronics and Reliability (UK)