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Code:
EP149
Description The electronics/microelectronics industry was approaching the $1 trillion market at the dawn of the new millennium. This makes the electronics industry both the largest market and the largest employer, surpassing the automotive industry. On the ever-changing technology landscape, the industry has responded and will continue to respond to competitive demands in the global marketplace. New electronic gadgets will be featured with increasingly higher functionality, further simplicity, lower cost and greater operational ease. Relentless innovations have enabled the development of digital wireless communications, computing, and imaging products, such as cellular phones, Internet-enabled devices, digital cameras, camcorders and notebook computers that were virtually non-existent a few years ago. What has transpired from these market demands is continued technological innovation and an ever-shortening product life cycle. Environment-friendly manufacturing and the delivery of environmentally benign end-use products that are ultimately safe at the end of the product life cycle will become essential to technology-business competitiveness. This is a continuing challenge to the industry. The purpose of this book is to help the industry meet and exceed the challenge of designing future electronics. This interdisciplinary and comprehensive volume consists of thirty-one (31) chapters and covers all of the important technologies with a practical treatment. As a result of over a decade of sustained research, a performance comparison of the viable alloy systems in basic materials properties will be presented. The book also includes a proper level of underlying fundamentals that are key to practical applications as well as specific studies on applications. Joining the author in contributing information and data to the book is an all-star faculty of renowned top experts from National Laboratories, the industry and academia — T. Baggio (Panasonic), D. Bernier (Litton-Kester), S. Chada (Motorola), K. Gilleo (Cookson), C. Handwerker (NIST), G. Henshall (Hewlett-Packard), C. Hunt (NPL), N. Lee (Indium), L. Lindsley (Hewlett-Packard), A. Rae (Cookson), G. Reed (EP&P), B. Richards (NPL), R. Schneider (Siemens), D. Shangguan (Ford), S. Shina (Lowell University), K. Suetsugu (Panasonic-Matsushita), D. Suraski (Aim), I. Turlik (Motorola), P. Vianco (Sandia Laboratories), B. Willis (EPS), P. Zarrow (ITM), Y. Zhang (Lucent) and C. Jorgensen (IPC Forum). The book’s content reflects the author’s belief that value-added industrial applications stem from the synergy of a general understanding of the big picture of technologies with an in-depth knowledge of a targeted application area and its consequent impact on business development. That belief prompted the writing of this book in an effort to facilitate the information flow and enhance a broad knowledge base, thus helping manufacturers worldwide to produce environmentally friendly and globally competitive electronics products. The book signifies a welcome to the new millennium. Without question, this is the most comprehensive and insightful guide — the one everyone involved in this high-profile, critical manufacturing technology should have and use. Greg Reed, Editorial Director, EP&P Magazine: "Environmental concerns, specifically lead-free electronics assembly, has risen to the forefront of industry trends today. No other issue occupies so much interest and debate among global electronics manufacturing professionals. Dr Hwang, the world's leading authority on this topic, has addressed the entire breadth of lead-free issues. From solder materials formulations through manufacturing processes and including fellow professionals' opinions and factual works, she has encompassed the state of the industry today." About the Author Dr Jennie S. Hwang is a recognised leader in the field of electronics assembly and interconnection. She is a popular lecturer/speaker worldwide and an advisor to the industry and the government. Hwang received her PhD in Materials Science and Engineering from Case Western Reserve University, two MS degrees in Liquid Crystals and Chemistry from Kent State University and Columbia University, respectively, and a BS in Chemistry. An invited lecturer/keynote speaker worldwide and holder of ten patents, Dr Hwang has authored over 180 publications including being sole author of four textbooks and a co-author of several books on leading technologies. Her books, columns, and publications have been widely cited in the industry worldwide. She is also a prolific author and speaker on topics related to trade, education, business and social issues. Among her many honours and awards, Dr Hwang is a member of the National Academy of Engineering-USA and has received Distinguished Alumni Awards from her two alma maters. She has also received US Congressional Certificates of Recognition and Achievements as well as the YWCA Women of Achievement Award. She has been named a Fellow of American Metal Society, 'Biographical profiler' of American Ceramic Society, is cited amont 'Leaders in Technology', 'Women in Technology' and 'Women Role Models', and has been inducted to the WITI Hall of Fame, Silicon Valley. She was recently named R&D Stars-to-Watch by Industry Week. Dr Hwang has served on various trade, civic and industry boards and committees, contributing to governance, education and community. She has held senior managerial positions with Lockheed Martin, Hanson plc, and IEM Corporation, and is currently president of H-Technologies Group, Inc. This company specialises in providing business and manufacturing solutions to the electronics/microelectronics interconnection industry.
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