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Environment Friendly Electronics: Lead-Free Technology
by Dr. Jennie S. Hwang

Contents List

The full Contents List is provided in downloadable Sample Pages in Adobe Acrobat format

Chapter 1
Introduction

Chapter 2
Industry Trends

Chapter 3
Global Legislation vs. Environment

Chapter 4
Fundamental Technology

Chapter 5
Related Patents

Chapter 6
Binary System

Chapter 7
SnAgBi System

Chapter 8
SnAgCu System

Chapter 9
SnAgSb System

Chapter 10
SnAgBiCu System

Chapter 11
SnAgBiIn System

Chapter 12
SnAgCuIn System

Chapter 13
SnAgCuSb System

Chapter 14
SnCuGaIn System

Chapter 15
Other Ternary Systems

Chapter 16
Other Quaternary Systems

Chapter 17
High-element Systems

Chapter 18 High and Low Temperature Systems

Chapter 19
Lead Coating and Surface Finish

Chapter 20
Intermetallic Compounds

Chapter 21
Compatibility with Reflow Process

 Chapter 22
Microstructure Evolution of SnAg

Chapter 23
Reliability

Chapter 24
Conductive Adhesive

Chapter 25
Design of Experiments

Chapter 26
Application Considerations

Chapter 27
Lead (Pb) Contamination Effects

Chapter 28
The Role of Bismuth

Chapter 29
Production-related Defect Guide

Chapter 30
Global Perspectives and Views

Chapter 31
Recommendations and Conclusions

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 Page last revised 11.02.05

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