Description
Although there are several
excellent publications dealing with printed wiring board (PWB)
fabrication, the area of Dry Film Photoresist Processing
Technology has received little specialised attention. This
handbook fills that gap admirably by addressing comprehensively
those fabrication steps directly or indirectly associated with
the function and performance of the resist. In the context of the
book, 'resist' refers mainly to negative working, aqueous
processable dry film photoresist as commonly used in circuit
imaging steps. The author includes a brief outline of the overall
PWB fabrication process, thereby usefully placing the technology
described in its proper context. Overall, the work reflects the
extensive knowledge and experience of the author and his
colleagues in this specialist area.
About the Editor
Dr. Dietz received a PhD in
organic chemistry from the University of Frankfurt, Germany, and
joined DuPont in 1967. He has held a variety of positions in
Research, Development, Production, and Quality Control in the
fields of dyestuffs, pigments, and organic intermediates before
he joined DuPont Electronics in 1984. Karl has managed
Development and Technical Market Support Groups for Electronic
Chemicals and Primary Imaging and has published widely on printed
circuit board fabrication materials and processes. His current
position is Senior Industry Manager with DuPont's Printed Circuit
Materials Group at Research Triangle Park, North Carolina, USA.
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