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EP06 view

HANDBOOK OF PRINTED CIRCUIT TECHNOLOGY

Volume 2: New Processes, New Technologies - English language edition

by G. HERRMANN & K. EGERER

Pages--382 + xvi; Tables--20; Figures--296; References--75; Size--21 x 15 cm.
ISBN 0 901150 26 6

Code: EP25

Contents of this page:

Description
Some Worldwide Reviews
Table of Contents

Description

This English language edition is a translation of Volume 2 of the ‘Handbuch der Leiterplattentechnik’ published in 1991 by Eugen G. Leuze Verlag, Saulgau, Germany. Volume 1, entitled ‘Handbuch der Leiterplattentechnik - Laminate, Manufacturing, Assembly, Test’, was published in 1982 and was widely acclaimed by the industry as a comprehensive handbook. Volume 2 has been compiled from contributions by an international team of 20 authors from Germany, Japan and the USA, drawing together specialised knowledge and expertise in the new processes and technologies which have emerged in recent years. In addition to a detailed description of processes, a summary is given of the costs of interconnection techniques at chip and board level so that comparisons may be drawn. This provides assistance in making the correct choice at the design phase of a new product. It can be critical for a product’s success that the appropriate interconnection technique is selected to fulfil quality and reliability criteria as well as producibility.

The book shows printed circuit manufacturers and all those associated with printed circuits where trends are leading as signal processing speeds continue to increase. Some technologies and processes have endured over the years with only slight modifications; others are completely new. The authors have set out to present the state of the art, and also to indicate the outlook for the future, without losing sight of where present business is gained and money earned.

A glance at the chapter headings, followed by a closer study of the detailed list of contents, will reveal the scope of this extremely up-to-date publication.

Some Worldwide Reviews

"At the start of this review, it was noted that perhaps this book was just another on PCB technology, two of the title pages giving just this impression. On the third, however, are added the words, ‘New Processes and New Technologies’. Perhaps to attract the potential reader these additional words should appear on the front, since the book is far from being just another one on the technology and these words do capture the essence of the work.

It is interesting, informative, with excellent drawings, graphs, tables and photographs to appeal to the wide audience to whom it was addressed."

Circuit World (UK)

Table of Contents

CHAPTER 1

History of Printed Circuit Boards

CHAPTER 2

Computer Aided Design (CAD) of Printed Circuits

G. Ferrari

2.1 Computer Aided Design

2.2 System Description

2.2.1 Basic Operation

2.2.2 General Capabilities

2.3 Library Development

2.3.1 Schematic Shapes

2.3.2 Physical Shapes

2.4 Data Entry

2.4.1 The CAD Approach to Placement

2.4.2 Detailed Automatic Placement Techniques

2.4.3 Additional CAD Placement Features

2.4.4 Conductor Routing

2.5 Back Annotation

2.6 Checking

2.6.1 Library Checks

2.6.2 Design Rule Check

2.6.3 Layout Checking/In-process

2.6.4 Final Checking

2.7 Corrections

2.8 Approvals

2.9. Output from CAD

2.9.1 Post Processing

2.10 Technology Effects on CAD

2.11 Hardware

2.11.1 Data Entry Devices

2.11.2 Output Devices

2.12 Computer Aided Manufacturing (CAM)

2.12.1 CAM Station

2.13 Interface Techniques

2.14 New Product Development

CHAPTER 3

Processing Techniques and Materials for High Technology Base Materials

T. Sarnowski

3.1 Why a Composite?

3.1.1 Conductive Cladding

3.2 Thermosetting Resins

3.2.1 Phenolic Resins

3.2.2 Polyesters

3.2.3 Epoxies

3.2.4 Modifiers

3.2.5 Cycloaliphatic Epoxies

3.2.6 Polyimides

3.3 Reinforcements

3.3.1 Cellulose Paper

3.3.2 Fibreglass

3.4 Coupling Agents

3.4.1 Volan

3.4.2 Silanes

3.5 Fillers

3.6 Construction and Manufacture

3.6.1 Impregnation

3.6.2 Lay-up

3.6.3 Lamination

3.7 Processing

3.7.1 Flatness

3.7.2 Surface Condition

3.7.3 Surface Geometry

3.8 Future Trends

CHAPTER 4

Flexible and Rigid-flex Circuits

H. Steffen

4.1 Flexible Circuits for Special Applications

4.2 Construction of Flexible Circuits

4.2.1 Dielectric Substrates

4.2.2 Adhesives

4.2.3 Metallic Coating

4.2.4 Cover Foils

4.3 Production Techniques for Flexible Circuits

4.3.1 Single-sided Flexible Circuits, Process Steps

4.3.2 Double-sided Flexible Circuits

4.3.3 Flexible Multilayers

4.4 Rigid-flex Circuits

4.4.1 Single-sided and Double-sided Constructions

4.4.2 Multilayer Constructions in Rigid and Flexible Area

4.5 Rigid-flex Circuit Production Techniques

4.6 Applications for and Examples of Flexible and Rigid-flex Circuits

CHAPTER 5

Microcircuits, Leadframes

W. Ganter

5.1 Definition, Requirements

5.1.1 Equipment Requirements

5.1.2 Component Requirements

5.1.3 Processing Technology, Costs

5.2 PCB Technologies Used

5.2.1 Printed Circuit Boards from Copper- clad Laminates

5.2.2 Tape Circuit Carriers

5.2.3 Leadframes

5.3 Thermoplastic Circuit Carriers

5.4 Comparison of Technologies

CHAPTER 6

Diescrete Interconnection Technology: Multiwire® and Microwire® Boards

T. Buck, D. W. P. Creavin, M. Fitzgibbon,

J. Hammond, M. Motazedi and D. P. Salerno

6.1 Introduction

6.2 Multiwire Product and Process Overviews

6.3 The Multiwire Board

6.4 The Multiwire Process

6.4.1 Format Preparation

6.4.2 Adhesive Lamination

6.4.3 The Wiring Process

6.4.4 Termination Process

6.4.5 Hole Drilling

6.4.6 Hole Cleaning

6.4.7 Hole Metallisation

6.5 Final Fabrication

6.6 Testing

CHAPTER 7

Fine Line Conductor Formation

H. Nakahara

7.1 Introduction

7.2 Definition of Fine Line Conductors

7.3 Fabrication Process for PWBs with Plated-through-holes (PTHs)

7.3.1 Surface Treatment of Virgin Copper Foil

7.3.2 Surface Treatment of Very Thin Copper Foil Clad Materials

7.3.3 Treatment of the Plated Copper Surface

7.3.4 Pattern Screening

7.3.5 Dry Film as an Etching and Plating Resist

7.3.6 Liquid Photo Resist

7.3.7 Exposure Light Sources

7.3.8 Glass or Film Phototool

7.3.9 Plotters

7.3.10 Laser Direct Imaging

7.4 Etching and Plating

7.5 Electroless Copper Plating

7.5.1 Electroless Panel Plate

7.5.2 Electroless Pattern Plate

7.5.3 Reliability of Electroless Copper

7.6 Fully Additive Process

7.7 Partly Additive Process

7.8 Summary

CHAPTER 8

Laser Direct Imaging System

N. Nakamura

8.1 Historical Background to Laser Direct Imaging

8.2 Description of Direct Imaging Process

8.2.1 Pattern Generation Process

8.2.2 Characteristics

8.3 Laser Direct Imaging Systems

8.3.1 Imaging Units

8.3.2 Data Conversion Unit

8.3.3 Optical Adjustment System

8.3.4 Automatic Loading and Unloading Equipment

8.4 Main Characteristics of the Imaging Process

8.4.1 Dry Film Resist

8.5 Conclusion

CHAPTER 9

SMT Assembly Techniqes

H. Pawlischek

9.1 Introduction

9.2 Advantages of Surface Mount Assembly

9.3 Classification of SM Assembly Systems

9.3.1 Performance Criteria

9.3.2 Design Criteria

9.4 Component Feed

9.4.1 Vibratory Feeder for Stick Magazines

9.4.2 Vibratory Feeder for Loose Components

9.4.3 Tape Feed Module

9.4.4 Feed Module for Taped Components

9.4.5 Feed Module for Tape Pak Magazine

9.4.6 Feed Module for Flat Packs

9.5 Extension of Component Feed Capacity

9.6 Placement Accuracy

9.7 Placement Capacity

9.8 Quality

9.9 Interlinking and Control

CHAPTER 10

Chip-on-Board

J. Moser

10.1 Alternative Chip-on-Board Interconnection Techniques

10.2 Requirements of the PCB Material

10.3 Packaging Technologies

10.4 Future Development Trends

CHAPTER 11

Soldering Technology

W. J. Maiwald

11.1 Introduction

11.1.1 The Importance of Soldering

11.2 Particular Demands on the SMD Solder Joint

11.2 Fundamentals of Soldering

11.2.1 General Information, Intermetallic Compounds

11.2.2 Solders in Use

11.2.3 Solderability

11.2.4 Wetting and Surface Tension of the Solder

11.2.5 Solubility of Metals

11.2.6 Dewetting

11.2.7 Solder Joint Strength

11.2.8 Impurities in Solders

11.2.9 Fluxes

11.2.10 Solder Pastes

11.3 Automatic Soldering Techniques

11.3.1 General Information

11.3.2 Summary

11.3.3 Wave Soldering

11.3.4 Reflow Soldering

11.4 Evaluation of Soldering Methods for SMDs

11.4.1 Summary

11.4.2 Thermal Stress on the SMDs

11.5 Cleaning of SMD Assemblies

11.6 Test Methods

11.6.1 Wetting Balance

11.6.2 Solderability Test for SMDs

11.6.3 Test Methods for Solder Pastes

11.6.4 Visual Assessment of Solder Joints

CHAPTER 12

The First Three Levels of Packaging

D.G. Grabbe

12.1 Level 0

12.2 Level 1

12.3 Level 2

12.4 Level 3

CHAPTER 13

Membrane Keyboard Technologies

K. Farnbauer-Schmidt

13.1 Origins

13.1.2 Why Membrane Keyboards?

13.2 State of the Art

13.2.1 Definitions

13.2.2 Theme

13.2.3 Why Integrate Components in Mem brane Keyboards?

13.2.4 Example of Membrane Switch Panels with LEDs

13.2.5 Technical Data

13.3 Materials

13.3.1 Summary of Materials in Use

13.3.2 Fundamental Theory

13.3.3 Carriers

13.3.4 Screenprintable Pastes

13.3.5 Inks

13.3.6 Spacer Technology

13.4 Components on the Foil

13.4.1 Criteria for Component Assembly, Properties

13.4.2 Assembly Technology

- Adhesive Pressure

- Manual Placement

- Automatic Assembly

- Adhesive Cure

13.4.3 Component Qualification

13.4.4 Typical Results

13.5 Technologies

13.5.1 Summary

13.5.2 Development

13.5.3 Production Methods

13.5.4 Testing Techniques

13.5.5 Process Flow Chart

13.6 Applications for Membrane Keyboards

13.7 Reliability

13.7.1 Quality Assurance

13.7.2 Test Criteria for Membrane Keyboards

13.8 Advantages of Membrane Keyboards

13.9 Marketing

13.9.1 Market Strategies

13.9.2 Market Survey

CHAPTER 14

Moulded Circuits

B.F. Barclay and D. J. Freed

14.1 Introduction

14.2 System Design Concept

14.3 Plastics Used for MIDs

14.4 Conductive Materials

14.5 Conductive Pattern Formation by Metal Plating

14.6 Polymer Thick Films for Conductor Formation

14.7 Other Conductor Formation Processes

14.8 Manufacturing Processes

14.9 Two-shot Moulded Interconnect Process

14.10 Photoselective Plating Process

14.11 Additive Plate-and-etch Process

14.12 Semi-additive Process

14.13 Masking Followed by Additive Plating

14.14 Fully Additive Paper Transfer Process

14.15 Markets for MIDs

CHAPTER 15

Market Development and Changes in Demand as the result of Technology and Product Cost Effects

G. Messner

15.1 Introduction

15.2 Changes in Components

15.3 Digitisation

15.4 Increased Production Speed

15.5 Rapid Turnaround and Prototype Production

15.6 Results of the Trend towards ASICs

15.7 Maturity and Worldwide Spread of ` Technology

15.7.1 Area Governed by Cost Factors

15.7.2 Intermediate Electronics Sector

15.7.3 Area Governed by Capacity Factor

15.8 Conclusions

 

 

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 Page last revised 11.02.05

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