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EP06 view

SETTING UP IN-HOUSE SURFACE MOUNT TECHNOLOGY

Practical Management & Technical Guidelines

by DAVID BOSWELL

Pages--324+xviii; Tables--31; Figures--32; Size--23 x 15 cm.
ISBN 0 901150 28 2

Code: EP27

Contents of this page:

Description
Some Worldwide Reviews
About the Author
Table of Contents

Description

This book has a bias towards the needs of small and medium-sized companies aspiring to introduce or set-up a surface mount facility. The ‘make or buy’ decision is reviewed, but it is then assumed that this was taken in favour of an in house facility I.E. the design and production of surface mount and mixed technology assemblies. The aim is to help managing directors and department heads in design, purchasing, production, quality , personnel and finance, in companies setting up a new line or running an existing operation.

The content is structured in two sections. It moves the reader step by step through each stage, first in the planning and then in the implementation of a facility. There is a strong emphasis on practical details and pitfall avoidance.

For the planning phase, the book offers methods of using likely component and printed board content of products to estimate capacity requirements. This information has then to be matched to realistic assessments of projected equipment capacity. Application environment determines the types of test programme to be catered for. These data are then factored into the activity levels of each department in the company so that workforce size and training costs can be estimated.

The financial penalties that come from ill-prepared sallies into the technology can be severe, but are easily avoidable. In the worst cases seen, the responsibility for planning and implementing the introduction of SM into a company has been delegated to a junior production engineer. Typically the order has been ‘Prepare a budget and process plan’, and later ‘Carry on and buy and install the equipment. We need to be fully operational within three months’. In most cases, this type of approach has signalled the complete absence of understanding of the many other vital issues which must be addressed.

The chapter headings in this book indicate the range of activities needing integration for success. Their breadth normally demands the personal drive and power of the managing director as project manager but, regrettably, sufficient technical background and training for the task has only rarely been seen at this level. A major difficulty observed in today’s European and US electronics manufacture, has been the lack of awareness among senior executives of what is needed to bring reliable surface mount technology onto the factory floor at minimum cost. This book sets out to address those key areas.

Some Worldwide Reviews

"Once read, it is certain that is will be referred to frequently during the course of setting up, and most copies will become dog-eared long before they finally reach the top shelf in the company library."

Microelectronics International (UK)

About the Author

Having been involved for over 25 years in surface mount technology, David Boswell has become one of the world’s leading experts in this activity. Following graduation at London University, he spent twelve years working at GEC (Hirst) Research Laboratories at Wembley on valve, cathode ray tube and semiconductor design and holds patents in these fields. He moved into film circuits and printed board production and general management in various companies including GEC, English Electric, Elliott Automation and ITT/STC. From 1965 to 1978 he ran the ITT Film Circuit Division at Paignton in Devon.

He was the primary founder of ISHM-UK and ISHM-Europe and has also served as the UK’s principal expert on international standards bodies such as the CECC and IEC and as chairman of Trade Association commercial and technical committees.

Later he became an independent management and technical consultant whose client list includes the United Nations, the British Government (DTI), BSI, GEC, CIT-Alcatel, British Telecom, Lucas, Mitsubishi, The Scottish Development Agency, ICL, Race, NEC, OKI, Epson, Thomson, Mars, Unitech, AB Electronics, Unitech, Racal, Stewart Wrightson, Scientific Generics, Cambridge Consultants, British Aerospace and others.

In 1985 he founded Surface Electronics Ltd in Poole, Dorset, a major specialist SM contract assembly company. Recently returning to consulting activities, in this r™le he became chairman and chief executive of the Joint Government (DTI)/Industry Surface Mount Club at NPL at Teddington, responsible for promoting the intelligent application of SM technology throughout the UK. This continues as a privatised partnership and currently he is also the principal UK representative in IEC TC 91 covering surface mount and related assembly technologies.

Table of Contents

PART 1: PLANNING

Chapter 1

Comparison of Electronic Assembly Technologies

1.1 Introduction

1.2 Through-hole (TH) or Conventional Assembly on Printed Boards

1.3 Surface Mount Assembly on Printed Boards

1.4 Mixed Technology Assembly on Printed Boards

1.5 Hybrid Thick Film Circuits on Ceramic Substrates

1.6 Tape Automated Bonding (TAB)

1.7 Chip on Board Assemblies (Face-up Types)

1.8 Ball Grid Arrays, Flip Chip Assemblies and Land Grid Arrays

1.9 Multichip Modules (MCMs)

1.10 Miniaturisation Comparisons

1.11 What Comes Next?

Chapter 2

Anatomy of the ‘Make or Buy’ Decision

2.1 Introduction

2.2 Management Training

2.3 Making In-house: the Benefits

2.4 Subcontracting: the Benefits

2.5 Making In-house: Budgeting for the Set-up Costs

2.6 Making In-house: A Disadvantage

2.7 Subcontracting: Budgeting the Costs

2.8 Subcontracting: Some of the Disadvantages

2.9 Conclusions

Chapter 3

Why SM? Why In-house SM Design and Assembly?

3.1 Why Use Surface Mount Technology?

3.2 Typical OEM Reasons for Setting Up In-house CAD Printed Board Layout Facilities

3.3 Typical OEM Reasons for Setting Up an In-house SM Assembly Facility

3.4 Assembly Structure Options

Chapter 4

Assessing Technical and Capacity Requirements

4.1 Printed Boards

4.2 Components

4.3 Assembly Structures

4.4 Application Fields

4.5 Scarce Resource Utilisation

4.6 Board Assembly Processes: Calculation Principles

4.6.1 Automatic Component Placement

4.6.2 Screen/Stencil Printing Solder Paste

4.6.3 Reflow Soldering

4.6.4 Cleaning

4.7 Visual Inspection

4.8 Rework

4.9 Equipment Assembly

4.10 Floor Space and Working Environment

Chapter 5

Departmental Effects: Planning the Changes Needed for SM

5.1 Design and Estimating Activities

5.1.1 New Subjects

5.1.2 Component Selection

5.1.3 Printed Boards

5.1.4 Cost Estimating

5.1.5 Product Safety (Hazard and Risk) Analysis

5.1.6 Design Management Realities

5.1.7 Summary

5.2 Purchasing Management Activities

5.2.1 Purchasing Manufacturing Equipment

5.2.2 Component Utilisation Cost Issues

5.2.3 Sourcing Components and Their Packaging

5.2.4 Component Solderability

5.2.5 Cover Tape Peel Strength Stability

5.2.6 Vendor Approvals

5.2.7 Summary

5.3 Materials Control and Logistics

5.3.1 Goods Inwards Inspection

5.3.2 Storage and Kitting

5.3.3 Production Control

5.3.4 Surplus and Replacement Components

5.3.5 Summary

5.4 Production Engineering and Process Planning

5.4.1 Solder Deposition

5.4.2 Reflow Soldering

5.4.3 Adhesives

5.4.4 Wave Soldering

5.4.5 Thermode (Heated Electrode or Hot Bar) Soldering

5.4.6 Cleaning

5.4.7 Inspection and Rework

5.4.8 Inter-process Handling

5.4.9 Stacking and Moving Assemblies

5.4.10 Summary

5.5 Manufacturing Housekeeping Disciplines and Training

5.5.1 Setting Up and Programming Machines

5.5.2 Machine Operation

5.5.3 Inter-station Work Handling Rules

5.5.4 Manual Operations — Assembly, Rework, Inspection

5.5.5 Operator Health and Safety

5.5.6 Awareness of Component Costs

5.5.7 Quality Standards and Inspection Routines

5.5.8 Operator Signature Methods

5.5.9 Managing Rework Loops

5.5.10 Clean Area Disciplines

5.5.11 Anti-static Precautions

5.5.12 New Job Specifications

5.5.13 Summary

5.6 Electrical Testing

5.6.1 In-circuit Test

5.6.2 Test Fixture Design

5.6.3 Summary

5.7 Quality Activities

5.7.1 Monitoring Design

5.7.2 Monitoring Processes

5.7.3 Monitoring Visual Inspection

5.7.4 Monitoring Changes

5.7.5 Summary

5.8 Factory Services and Maintenance

5.8.1 Clean Area Planning

5.8.2 Machine Ambient Control

5.8.3 New Supply Services

5.8.4 Machine Maintenance

5.8.5 Disposal of Used Materials, Scrap and Effluent

5.8.6 Health and Safety Aspects

5.8.7 Summary

5.9 Sales and Marketing Responsibilities

5.9.1 Treatment of a Surface Mount Production Line as a Marketing Tool

5.9.2 Exploiting the ‘Keeping Up with the Jones’’ Technology Factor

5.9.3 Field Support and Spares Logistics, Repair Specifications, Training

5.9.4 Revised Customer Returns Policy

5.10 Accounts Department Activities

5.10.1 New Production Yield Concepts

5.10.2 Revised Inventory Valuation Method

5.10.3 Revised Cost Collection Methods

5.10.4 Summary

5.11 Managing Director

 

Chapter 6

Initial and Ongoing Training Requirements

6.1 The Chief Executive

6.2 Senior Management Training

6.3 Middle Management Training

6.4 Training Production Line Personnel

6.4.1 Manual Operators

6.4.2 Machine Setter-operators

6.4.3 Technicians

6.5 The Cost of Training

Chapter 7

Capital Investment

7.1 The Reasonable Minimum

7.2 Basic Prototype Facilities

7.2.1 Basic Prototype Facility with Reflow Soldering

7.2.2 Basic Prototype and Pilot Production Facility with Wave Soldering

7.3 Medium-scale Production with Mixed Technology (Professional)

 

Chapter 8

Product Cost Estimating and Cost Collection

8.1 Why is Cost Estimating Different for SM Assemblies?

8.1.1 Production Yield Losses

8.1.2 Step and Repeat Arrays

8.1.3 Rework

8.1.4 Visual Inspection

8.1.5 CAD for Circuits and Layout

8.1.6 Printed Boards

8.1.7 Learning Curve

8.2 Labour-based Cost Estimating Methods

8.3 Machine-based Cost Estimating Methods

8.4 ‘Scarce Resource’ Costing

8.5 Mixed Machine and Labour-based Costing

8.6 A Typical Labour-based Cost Estimate

8.6.1 General Points

8.6.2 Materials

8.7 Tooling Costs

Chapter 9

Selecting Manufacturing and Quality Control Equipment

9.1 Introduction

9.2 Solder Paste Deposition

9.2.1 Screen (Off-contact) Printing

9.2.2 Stencil (In-contact) Printing

9.2.3 Syringe Dispensing

9.2.4 Quality Control Equipment

9.3 Component Placement (Populating the Printed Board)

9.3.1 Feeding Components into Placement Machines

9.3.2 Automatic Placement Machines

9.3.3 Optical Alignment

9.3.4 Machine Set-up Time

9.3.5 Manual and Assisted Manual Placement Equipment

9.3.6 Quality Control Equipment

9.4 Depositing and Curing Non-conductive Adhesive

9.4.1 Deposition

9.4.2 Curing

9.4.3 Measuring Component Adhesion after Curing

9.4.4 Quality Control Equipment

9.5 Reflow Soldering Equipment

9.5.1 General Points

9.5.2 Static Ovens

9.5.3 Infra-red Pass-through Ovens

9.5.4 Convection Oven (Air) Soldering

9.5.5 Mixed Infra-red and Convection Ovens

9.5.6 Convection Oven (Nitrogen) Soldering

9.5.7 Thermal Capacity

9.5.8 Vibration

9.5.9 Oven Length

9.5.10 Adhesive Curing in a Reflow Oven

9.5.11 Profiling Kit

9.5.12 Other Features

9.6 Wave Soldering Machines

9.6.1 Fluxing

9.6.2 Pre-heat Profile

9.6.3 Types of Wave

9.6.4 Types of Solder

9.6.5 Peak Lopping

9.7 Thermode Soldering

9.8 Laser Soldering

9.9 Cleaning/No Cleaning

9.9.1 The ‘No Clean’ Options

9.9.2 Why Clean?

9.9.3 The Cleaning Method Options

9.10 Visual Inspection Equipment

9.11 Rework Equipment

9.12 Electrical Test Equipment

9.12.1 Checking Components at Goods Inwards

9.12.2 In-circuit Testing

9.12.3 Functional Test Equipment

 

Chapter 10

Workforce Health and Safety, and Product Safety

10.1 Fumes

10.2 Hot Surfaces

10.3 Radiation

10.4 Electric Shock

10.5 Fire

10.6 Explosion and Implosion

10.7 Cutting, Crushing and Trapping

10.8 Handling, Storage and Disposal of Potentially Harmful Materials

10.9 Machine-operator Ergonomics

10.10 Product Safety Analysis

 

PART 2: IMPLEMENTATION

Chapter 11

Managing the Design Stages

11.1 Introduction

11.2 Phase D1: CAD Equipment for Board Layout

11.2.1 Features

11.3 Phase D2: Design Activity

11.3.1 Design for Manufacture

11.3.2 Design for Visual Inspection

11.3.3 Design for Electrical Test

11.3.4 Design for Rework

11.3.5 Design for Components

11.3.6 Design for Reliability and Safety

11.3.7 Board Size Estimating

11.3.8 Cost Estimating

11.4 Phase D3: Specifying Surface Mount Printed Boards

11.4.1 Supplier’s ‘Front End’ System

11.4.2 Photomasters, Floppy Disks and Dimensioned Drawings

11.4.3 Specifying Base and Prepreg Materials

11.4.4 Initial and Final Copper Thickness

11.4.5 Track and Gap Tolerances

11.4.6 Solder Resist Materials

11.4.7 Multilayering Data

11.4.8 Solderable Surfaces

11.4.9 Pre-flux Coatings

11.4.10 Anti-tarnish Coatings

11.4.11 Non-soldered Conducting Surfaces

11.4.12 Step and Repeat Requirements

11.4.13 Panel and Individual Board Sizes

11.4.14 Jigging Holes and Other Apertures

11.4.15 Optical Alignment (Fiducial Correction) Marks

11.4.16 Vias and Plated-through Holes

11.4.17 Board Flatness

11.4.18 Track Defects and Repair Methods

11.4.19 Component Location Marking (‘Legend’ or ‘Ident’)

11.4.20 Bare Board Testing

11.4.21 Defective Circuits in Arrays

11.4.22 Test Coupons

11.4.23 Intended Assembly Process Parameters

11.4.24 Issue Number and Date Coding Method

11.4.25 Bare Board Transit Packaging

11.5 Phase D4: Design Checking

11.5.1 Checking the Net List

11.5.2 Printed Board Layout, Component Selection and Equipment Structure Checks

11.5.3 Electronic Circuit and Printed Board Layout Designer Requirements

 

Chapter 12

Setting up for Prototyping and Limited Production

12.1 Managing Prototyping

12.1.1 Training

12.1.2 Board Checks at Prototype Stage

12.1.3 Pre-heating before Manual Assembly Operations

12.2 Starting Small-scale Production

12.3 Managing Medium-scale Production Start-up using Reflow Techniques

12.3.1 Solder Paste Printing

12.3.2 Reflow Soldering

12.3.3 Pick and Place Components

12.4 Managing Medium-scale Production Start-up using Wave Soldering

12.4.1 Adhesive Deposition

12.4.2 Wave Soldering

12.5 Thermode Soldering

12.6 Post-placement Inspec tion

12.7 Managing Rework

12.8 Cleaning Disciplines

Chapter 13

Assessing Product Reliability and Fitness for Purpose

13.1 Introduction

13.2 The ‘Life Calendar’

13.3 Failure Mechanisms

13.3.1 Solder Joints

13.3.2 Components

13.3.3 Printed Boards

13.4 Test Protocols

13.5 Screen Tests

13.6 Component Supplier Responses to Field Failures

Chapter 14

Trouble-shooting Printed Boards and Components

14.1 Introduction

14.2 Printed Boards

14.2.1 Materials

14.2.2 Defects and Causes

14.3 Surface Mounted Components

14.3.1 Passive Leadless (Chip) Types

14.3.2 Encapsulated Passive Components with Leads

14.3.3 Discrete Leadless Semiconductor Devices

14.3.4 Discrete Plastic-encapsulated Semiconductor Devices with Tape Leads

14.3.5 Plastic-encapsulated

Semiconductor Integrated Circuits with Tape Leads

14.3.6 Cavity Package Semiconductor Integrated Circuits

14.3.7 Tape Automated Bonding (TAB) Devices

14.3.8 Multichip Modules (MCMs)

14.4 Through-hole Components

14.4.1 Pin Grid Arrays

14.4.2 Single-in-line Modules

14.4.3 Hybrid Circuits

14.5 Defects and Causes

Chapter 15

Trouble-shooting Materials, Processes and Electrical Test

15.1 Introduction

15.2 Solder Paste

15.3 Depositing Solder Paste

15.3.1 Screen (Off-contact) Printing

15.3.2 Stencil (In-contact) Printing

15.3.3 Syringe Dispensing of Solder Paste

15.4 Depositing Non-conducting Adhesives

15.5 Component Placement

15.6 Corrective Action prior to the Soldering Processes

15.7 Curing Non-conducting Adhesive

15.8 Infra-red (IR) and ‘Convection’ Reflow Soldering

15.9 Nitrogen Atmosphere Reflow Soldering

15.10 Thermode Reflow Soldering

15.11 Wave (Flow) Soldering

15.12 Break-out from Panels

15.13 Component Insertion

15.13.1 Insertion prior to Wave Soldering

15.14 Cleaning after Soldering

15.15 Post-assembly Visual Defect Classification and Causes

15.15.1 Objectives of Post-assembly Visual Inspection

15.15.2 Parts per million (ppm) ‘Non-conformance’ Levels

15.16 Rework

15.17 In-circuit Test

15.17.1 Probe Systems

15.17.2 Board Deformation

15.18 Functional Test

 

Chapter 16

Managing Process Control, Visual Inspection and Yield Improvement in Production

16.1 Introduction

16.2 Data Collection and Process Monitoring Charts

16.3 Likely Causes of Defects in Surface Mounted Assemblies

16.4 Recommended Recordable Defects for each Process

16.5 Definitions of Pre- and Post-soldering Defects and Comments thereon

16.5.1 Solder Paste Deposition

16.5.2 Adhesive Dispensing

16.5.3 After Component Placement

16.5.4 After Wave Soldering

16.5.5 After Reflow Soldering

16.5.6 After Hand Soldering/After Rework

16.6 Post-soldering Visual Inspection

16.6.1 Objectives of Visual Inspection

16.6.2 Assessment Criteria

 

Appendix 16A

Visual Inspection Guidelines for Soldered Surface Mounted Component Assemblies

Introduction

Part 1: General Requirements Applicable to all Surface Mounted Components and Related Solder Joints

Part 2: Guidelines for Soldered Component Bodies and Terminations

Part 3: Guidelines for Solder Joints on Specific Component Types

 

Chapter 17

Rework and Repair

17.1 Introduction

17.2 Key Problems in Surface Mount Rework

17.2.1 Non-marking of Components

17.2.2 Pre-heating Components

17.2.3 Handling of Components

17.2.4 Re-use of Removed Components

17.2.5 Printed Board Layout Design and Space Constraints

17.2.6 Heat Sinking Effects

17.2.7 Choice of Adhesives for Wave Soldering

17.2.8 Printed Board Material Type

17.2.9 Copper Pads and Track Layout

17.2.10 Rework of Very Fine Pitch Device Leads

17.3 Selection of Suitable Rework Equipment

17.3.1 Dependence on Component Types on the Printed Board

17.3.2 Dependence on Printed Board Laminate Type

17.3.3 Dependence on Assembly Structure and Soldering Processes

17.4 Preparation for Rework and Repair

17.4.1 Pre-baking of Assemblies prior to Component Replacement

17.4.2 Anti-static Precautions

17.4.3 Removal of Adjacent Components and Conformal Coating

17.4.4 Cleaning of Assemblies prior to Rework

17.4.5 Masking of Sensitive Components

17.4.6 Pre-heating of Large Boards

17.4.7 Pre-heating of Sensitive Components

17.5 Rework Activity Classification

17.5.1 Component Re-alignment

17.5.2 Component Removal

17.5.3 Addition of Flux and Solder

17.5.4 Removal of Excess Solder

17.5.5 Component Replacement

17.5.6 Rework Activity Classification

17.6 Rework Machines, Tools and Methods

17.6.1 Miniature Conventional Soldering Irons (Manual)

17.6.2 RF-powered Soldering Irons (Manual)

17.6.3 Hot Gas Pencils (Manual)

17.6.4 Heated Tweezers (Manual)

17.6.5 Soldering Irons with Special Bits

17.6.6 Hot Gas Rework Machines

17.6.7 Focused Infra-red Light Beams

17.6.8 Thermode (Hot Electrode) Equipment

17.6.9 Laser De-soldering

17.6.10 Conventional (e.g., 50 watt) Soldering Irons

17.6.11 Hotplates

17.6.12 Pneumatic Dispensers

17.6.13 De-soldering Tools, as used for Through-hole Assemblies

17.6.14 Tweezers and Vacuum Pencils

17.7 Field Repair Philosophy

 

Chapter 18

Project Management Issues and Implementation Costs

18.1 Chief Executive

18.2 Departmental Action Requiring Initiation by the Chief Executive

18.2.1 Design

18.2.2 Purchasing and Stores

18.2.3 Production Engineering/Process Planning

18.2.4 Electrical Test

18.2.5 Production Control

18.2.6 Manufacturing Operations

18.2.7 Accounts

18.2.8 Quality

18.2.9 Sales and Marketing

18.2.10 Factory Services

 

Chapter 19

Budget Summary

19.1 Capital Items

19.2 Small Tools

19.3 Training/Planning Time and Costs additional to Normal Duties

19.4 Memo: Start-up Losses (Actuals dependent on many Factors)

 

Chapter 20

Bibliography, Specifications, Sources of Management and Technical Assistance and Training

20.1 Books

20.2 Standards and Specifications related to Surface Mount Technology

20.2.1 International Specifications

20.2.2 American Specifications

20.2.3 UK Standards

20.2.4 Key

20.2.5 Addresses for Standards Bodies

20.3 Some Independent Specialist Sources of Management and Technical Assistance

20.4 Other Sources of Specialist Technical Assistance

20.5 Sources of Information on Surface Mount Manufacturing Equipment, Components and Materials

20.6 UK Sources of Technical and Management Training

 

Chapter 21

Definitions and Abbreviations

 

Index

 

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 Page last revised 11.02.05

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