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Code: EP29 Contents of this page:Description DescriptionThe book ‘Manufacturing Techniques for Surface Mounted Assemblies’ has been written for those who are responsible for and active in the development and manufacture of electronic assemblies, typically printed circuit boards carrying surface mounted devices. In view of the subjects treated, this book is indispensable to those employed in R&D and production, such as design engineers, production engineers and their managers. It is, however, not a handy ‘do it yourself manual’ for beginners. This book intends to provide practical information, but related to background knowledge and understanding. The authors hope that the understanding provided will be of long-lasting significance to readers. The book starts with a chapter identifying changes and trends in surface mounting. Components and boards, including flexible substrates, are treated as far as this is useful for the following chapters. A few examples of subjects are coplanarity of leads, multichip modules, ball grid arrays, accuracy and reference on the board, and board finishes. (The manufacturing techniques of printed circuit boards are not addressed.) The manufacturing flow line for surface mounted assemblies (process integration) forms a central theme in the material discussed. Details of such a line are dealt with at length: the design of footprints on the board, the stencil printing of solder paste, the placement of components, reflow soldering, inspection of the product by visual methods and by using fully automatic techniques, plus repair of faulty connections. A full chapter is devoted to processes for microelectronics (chip on board, connection of foils, etc.), including wire bonding, TAB and adhesive bonding. Ample attention is given to laser soldering. Considerable attention is paid to the principles of process control, with an elucidation of reflow soldering. With regard to the solder metals to be used, information is given on compositions, cracking of joints and solderability assessment, etc., with special attention devoted to the matter of lead-free solders. With regard to fluxes and their environmental effects, methods of reducing the amount of flux are evaluated, with special attention to inert gas soldering, for both wave soldering and reflow soldering. The issue of cleaning (or not cleaning) is considered, in relation to the present environmental requirements. Some 300 literature references are given at relevant places in the text, and a glossary of about 200 terms and acronyms used in the field of SMT is included. About the AuthorsReinard J. Klein Wassink (family name Klein Wassink) was born in the Netherlands in 1933. He studied metallurgy at the Technical University of Delft, Holland, where he received his degree in 1962. After graduation, he was employed throughout his professional working life at Philips in Eindhoven. His first appointment was from 1962 to 1974, conducting research in the fields of metals and ceramic technology at the Research Laboratories. His second appointment was as leader of a group at the Centre for Manufacturing Technology (CFT). This group worked on subjects related to mounting technology and mechanised soldering techniques as applied in the production of electronic assemblies on all types of printed circuit boards and hybrid circuit substrates. Thirdly, he was responsible for the development of the technology of surface mounting within the SMD Technology Centre and, finally, he was scientific advisor within the Circuit Technology department of the CFT. Mr Klein Wassink retired from Philips in October 1993. To some extent, the present book complements Klein Wassink’s ‘Soldering in Electronics’, which was published by Electrochemical Publications Ltd in 1984, with a second edition in 1989. This book, covering the complete field of mass production soldering, was well received and is considered to form the most comprehensive contribution to the subject of soldering. Furthermore, the book was translated into German and Japanese. The present book has a wider scope because the manufacturing techniques comprise more than soldering alone, and yet there are many points of contact. The authors have deliberately limited the overlap of the two books. Thus, many details of, for instance, reflow and wave soldering processes are not present in the ‘new’ book. However, there is still ample discussion on recent developments of inert gas soldering. Martin M.F. Verguld was born in the Netherlands in 1952. At the age of 18, he started working for Philips, where he joined the research group on fundamental aspects of soldering. His work there included participation in the development of the wetting balance for wired components. In 1979, he graduated in chemical technology. In the same year, he transferred to the CFT to work as process development engineer in the group of his co-author, where, in 1989, he became leader of the group. The group focuses on mechanised production techniques, as applied in electronic assembly, with an emphasis on surface mounting in all its aspects. Mr Verguld has contributed to the development of the methodology for process control in electronic assembly. Furthermore, he has been in charge of several Total Quality Control projects in factories, both within Philips and outside (as support for Philips) around the globe. It is clear that the two authors have worked together for a great many years, during which they were actually involved in the very beginnings of the surface mounting technique. Their work has included subsequent, repeated contributions to the further development of this manufacturing technique, which is the subject of this present book. The two authors each have about 50 original publications to their name and have given numerous presentations at seminars, conferences and workshops world-wide. In view of their background, research activities and activities (on various committees, etc.), both authors may be regarded as true specialists in the subject of their joint book, and capable of presenting first-class material. Some Worldwide Reviews"Reinard Klein Wassink and Martin Verguld have put together a well presented, well documented, up-to-date, thought provoking book on a manufacturing technology which has developed with the steep rise in the use of surface mount components over the last fifteen years. The information is obviously based on first-hand experience gained in the circuit technology department at Philips Centre for Manufacturing Technology in Eindhoven, The Netherlands. The authors and the Centre are to be thanked for allowing so many of their measurements and observations to be made readily available. It is well referenced with an authors’ index and cross-references to ‘The Book’ (namely Klein Wassink’s Soldering in Electronics’). The overall presentation of this new technology is impressive, as is the comprehensive glossary of terms." Microelectronics International (UK) Table of Contents
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