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A COMPREHENSIVE GUIDE TO THE DESIGN AND MANUFACTURE OF PRINTED BOARD ASSEMBLIES - VOLUME 2

by W. MACLEOD ROSS

Pages--1109+xxxiv; Tables--70; Figures--433; References--521;
ISBN 0 901150 33 9

Code: EP30

Contents of this page:

Description
About the editor
Table of Contents
Some Worldwide Reviews
Volume 1

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FULL CONTENTS LIST - 28 pages (62.5KB)
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Description

The printed board assembly is still the keystone of a majority of circuit realisations and correct, cost-effective design and production are essential if reliable assemblies are to be obtained at optimum cost. To achieve this aim an understanding of all aspects of assembling and joining techniques is of paramount importance. This is the only book to cover in a practical manner all facets of the design and manufacture of printed board assemblies, from inception to final completion. Because of the amount of detail provided, it has been found necessary to divide the text into two volumes, the first covering components, assembly techniques and design, the second covering manufacture of printed boards of all types, quality assurance, cleaning and the environment, and marketing and product costing.

Volume 1 describes conventional (pin-in-hole) and surface mounting components and their packages before going on to discuss manual and automatic methods of assembly in considerable depth. Only then are the principles of design and layout of circuits set out. The importance of paying careful attention to thermal management of the design is stressed. The first volume finishes with a section which comprises five chapters on soldering and joining — almost a book in itself.

Volume 2 begins with a section that describes in a number of separate chapters the materials and basic methods for fabricating printed boards. The next section in this volume covers the different types of circuit board and gives their manufacturing outlines. Contamination control, effluent, environmental problems arising from electronics assembly and occupational health are the subjects of the chapters in the third section. Section 4 deals with quality assurance, testing and training and education and the volume concludes with a discussion of marketing and financial matters.

Written by authorities drawn from a worldwide pool of expertise, this book will be a valuable reference source to designers, producers and users of printed board assemblies.

About the editor

This book is edited by Bill MacLeod Ross who is also a major contributor. Mr Ross has extensive experience of materials, process technology and quality assurance and control in the electronics industry, having spent over 30 years in senior positions in that industry. For the past few years, he has been managing director and chief consultant for a company specialising in quality assurance, including setting up ISO 9000 quality systems, and problem solving in the industry.

A graduate of London University, Mr Ross is a Fellow of the Institute of Quality Assurance, of the Institute of Metal Finishing and of the Institute of Circuit Technology (of which he is a founder member). He participates in the work of several trade association and BSI committees relevant to the electronics industry and is an active member and supporter of the PCIF.

Mr Ross has contributed to several text books and has written many technical articles and papers.

Table of Contents

VOLUME 2

MANUFACTURE, QUALITY ASSURANCE AND THE ENVIRONMENT

Section 1: Materials and Basic Methods of PB Manufacture

Chapter 1

Base Materials

Part 1 - Organic Resin Based Laminates

1.1 Introduction

1.2 Manufacture of Epoxy/Glass Laminates

1.3 Key to the Quality Characteristic ÔAIICÕ for Laminates

1.4 Prepregs for Multilayer Manufacture

1.5 Base Material Defects

1.6 Paper Laminates

1.7 Composite Laminates

1.8 High Performance Laminates

1.9 PTFE/Glass Laminates

1.10 Flexible Laminates

1.11 Specialty Laminates

Part 2 - Ceramics and Glass Substrates

1.12 Introduction

1.13 Production of Ceramics

1.14 Properties

 

Chapter 2

Machining

Part 1 - Mainly Mechanical

2.1 Introduction

2.2 Fundamental Considerations

2.3 Detailed Considerations

2.4 Machining to Establish Geometry

2.5 Machining to Establish Interconnection

Part 2 - Laser Drilling and Machining

2.6 General

2.7 Mechanism of Laser Drilling

2.8 Laser Types used in Laser Drilling

2.9 Laser Drilling Processes

2.10 Constructions of Printed Boards Suitable for Laser Drilling

2.11 Via Formation Processes

2.12 Practical Laser Drilling Systems

2.13 Growth Rate

2.14 Laser Safety Information Sources

 

Chapter 3

Screen Printing

3.1 Introduction

Part 1 - Stencils

3.2 A Key Issue in the Nineties and Beyond

3.3 The Screen or Stencil and Factors Controlling it

3.4 Inspection/Quality Control

Part 2 - Screen Printing Inks

3.5 Introduction

3.6 Raw Materials

3.7 Drying and Curing Systems

3.8 Applications

3.9 Processing Parameters

3.10 Quality Control

Part 3 - Printing Machines for Surface Mount

3.11 Introduction

3.12 Printing Solder Paste

3.13 Printing Machines

3.14 Printing Conductive and Non-Conductive Adhesives

3.15 Other Machine Considerations

 

CHAPTER 4

Photoimaging

4.1 Introduction

4.2 Liquid Photoresists: Methods of Application, Drying and Imaging

4.3 Dry Film Photoresists

4.4 Dry Film Processing

4.5 Inspection

4.6 Future Trends

4.7 A Summary of Process Features and Controls

 

CHAPTER 5

Etch Resists and Etching

5.1 Introduction

5.2 Resists

5.3 Etchants

5.4 Etching Equipment

5.5 Regeneration, Recycling and Disposal of Etchants

5.6 Inspection

5.7 Future Trends

 

CHAPTER 6

Metal Deposition

6.1 Electroless Plating

6.2 Electroplating

6.3 Basic Chemical and Electrochemical Reactions

6.4 General Methods of Attaining Desired Properties from Plating Processes

 

CHAPTER 7

Other Materials and Processes

7.1 Introduction

7.2 Via Formation Processes

7.3 Thermo/Physical Ablation of Vias

7.4 Laser Formed Via Printed Boards

7.5 Physical Displacement Produced Via Printed Boards

7.6 Photo-Sensitive Dielectric Produced Via Printed Boards

7.7 Chemical/Metallurgical Bonded Via Printed Boards

7.8 Materials

7.9 Standards and Specifications

7.10 Conclusion

 

Section 2: Major Types of Printed Board

CHAPTER 8

Single- and Double-sided PBs

8.1 General

8.2 Basic Processes for Producing Single/Double-Sided PBs

8.3 Flush Bonded PBs

8.4 Die-Stamped Printed Boards

8.5 In Conclusion

 

CHAPTER 9

Plated Through-hole PBs

9.1 General

9.2 Basic Processes for Producing Double-Sided PTH Printed Boards

 

CHAPTER 10

Multilayer PBs

10.1 The Need for Multilayer Printed Boards

10.2 Multilayer Constructions

10.3 Bonding Preparations

10.4 Lay-Up of a Multilayer Stack

10.5 Multilayer Presses

10.6 Press Cycle

10.7 Quality Control

10.8 Impedance Controlled Multilayer Printed Boards

 

CHAPTER 11

Flexible Circuits

11.1 General

11.2 An Outline of Flexible and Flexi-Rigid Circuits

11.3 Economics

11.4 Applications

11.5 Design Aspects Specific to Flexible Circuits

11.6 Manufacturing Processes Specific to Flexibles

11.7 Multilayer Flexi-Rigid

11.8 Assembly and Termination

11.9 Special Flexible Circuits and their Applications

 

CHAPTER 12

Polymer Thick-film PBs

12.1 Introduction

12.2 Polymer Thick Film Circuits

12.3 Base Material

12.4 Inks

12.5 Interface

12.6 Manufacturing

12.7 Production Line

12.8 PTF Characteristics

12.9 Applications

12.10 Future Outlook

 

CHAPTER 13

Moulded Interconnection Devices

13.1 Introduction and Concept

13.2 Technology

13.3 Design

13.4 Markets and Applications

13.5 Mid Research Associations

 

CHAPTER 14

Discrete Wired PBs

14.1 Introduction

14.2 The Multiwire Technique

14.3 Wiring Information Preparation

14.4 Metal-Cored and Multilevel Multiwire Circuits

14.5 Microwire Circuits

14.6 Increasing Wiring Density

14.7 High Speed Signals

14.8 Multiwire/Microwire Performance

14.9 Uses of Multiwire and Microwire Technology

14.10   Multiwire Versus Microwire

14.11 Conclusion

 

Section 3: Cleaning and the Environment

CHAPTER 15

Cleaning and Contamination Control

15.1 Introduction

15.2 Cleaning Methods

15.3 Cleaning Equipment

15.4 Contamination Control

15.5 The Importance of Statistical Analyses

15.6 Quality Assurance

 

CHAPTER 16

Water and Effluent Treatment

16.1 Introduction

16.2 Water

16.3 Effluent - Why We Cannot Just Dump

16.4 Ion Exchange

16.5 Reverse Osmosis

16.6 Other Techniques

16.7 Which Plant?

16.8 Examples of how Representative Printed Circuit Companies have Tackled the Effluent Problem

16.9 In Conclusion

 

CHAPTER 17

Environmental Problems

17.1 Introduction

17.2 Air Pollution

17.3 Water Pollution

17.4 Soil Pollution

 

CHAPTER 18

Occupational Health

18.1 Introduction

18.2 Hazards Resulting from Chemical Agents

18.3 Hazardous Rating and Labelling Systems

18.4 Hazardous Materials in the Electronics Industry

18.5 Hazardous Ingredients in Cleaning Solutions

18.6 Electroplating and Etching Solutions

18.7 Hazardous Ingredients from Solders and Fluxes

18.8 Disposal of Waste

18.9 Safety Precautions in Assembly and Cleaning Operations

18.10 Government Regulations

 

Section 4: The Attainment of Quality

CHAPTER 19

Quality Assurance and Control

19.1 Introduction

19.2 Definitions

19.3 Organisation for Quality Assurance

19.4 Motivation for Quality

19.5 Quality Costs

19.6 Data Retrieval and Presentation

19.7 Sampling and Sampling Plans

19.8 Reliability

19.9 Control of Quality

19.10 Planning

19.11 Control and Storage of Documentation

19.12 The Business Quality Manual

19.13 A Quality Management System

19.14 Assessments, Audits and Nonconformities

 

CHAPTER 20

Testing the Product

20.1 General

20.2 Manual Inspection and Testing

20.3 Automatic Test Equipment (ATE)

 

CHAPTER 21

Training and Education

21.1 A Tale of Two Factories

21.2 Training and the High-Performance Workplace

21.3 Assessment and Standards in Workforce Development

21.4 Core Education and Training

21.5 Specialised Education and Training in Electronics Manufacturing Technologies

21.6 Formal Training and Resources: Partners in Workforce Development

21.7 The Need for Workforce Training and Education in Other Countries

21.8 Help At Hand

 

Section 5: Markets and Finance

CHAPTER 22

Marketing PBs and Assemblies

22.1 The PCB Marketplace

22.2 Demand Levels

22.3 Technology Drivers

22.4 Market Segmentation

22.5 Market Research

22.6 Marketing in Action Ñ the Four Ps: Product, Price, Place, Promotion

22.7 Market Communications

 

CHAPTER 23

Product Costing

23.1 Introduction

23.2 Costing

23.3 Pricing

23.4 Summary

 

CHAPTER 24

Finance

24.1 The Need for Finance

24.2 Types of Finance

24.3 Debt

24.4 Equity

24.5 Comparison of Debt and Equity

24.6 Types of Debt

24.7 Dealing with Banks

24.8 Types of Equity

24.9 Sources of Equity

24.10 Basic Rules for Financing a Business

24.11 Methods of Working Capital Management

24.12 Management Buyouts/Buyins

 

CHAPTER 25

Information Technology

25.1 Introduction

25.2 Information Transmission Modes

25.3 Particular Issues

25.4 Future Trends in it - Software, Information, Services

25.5 On-Line Services

 

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Some Worldwide Reviews

"Many readers will be familiar with the blockbusters TV movie that is broadcast in two parts due to the amount of subject matter being too large for digestion in one viewing. In similar vein, the amount of information contained within the pages of ‘A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies’ has been wisely committed to two volumes, each a self-contained book but nevertheless complementary to the other volume." ...

"In summary, this is a magnificent reference book which will appeal to all members of the electronics interconnection industry from shop floor to boardroom. Mr Ross and the contributing authors deserve hearty congratulations for the style and contents of this excellent volume."

Circuit World (UK)

 

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 Page last revised 11.02.05

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