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EP31 view

THICK-FILM TECHNOLOGY AND APPLICATIONS

by M. R. HASKARD & K. PITT

Pages--177+ix; Tables--27; Figures--97; References--163;
ISBN 0 901150 35 5

Code: EP31

Contents of this page:

Description
About the authors
Table of Contents

Description

This book is the result of a collaboration between two authors with complementary expertise in thick-film technology, both in industrial applications and in teaching. Although a theoretical background is provided where appropriate, the approach concentrates on the design, manufacture and applications of thick-films.

Five of the ten chapters look at manufacturing aspects including process technology, pastes and substrates, components, packaging and assembly and the influence of the environment. One chapter examines recent technology developments and the remainder discuss design, applications and sensors. Information is given on a range of thick film sensors and their possible applications. The importance of thick-film technology in high speed and microwave applications is looked at in detail. Sections on thermal design and reliability support those on electrical design and layout.

A unique feature of the book is the presentation of a PC compatible disk with it containing the thick-film CAD program CAHL (Computer Aided Hybrid Layout), developed at the University of South Australia.

About the authors

Malcolm Haskard was Professor the Microelectronics, Head of the School of Electronic Engineering and Founding Director of the Microelectronics Centre at the University of South Australia. He retired in late 1996 and now assists the University and Microelectronics Centre as an Adjunct Professor. His research interests include microelectronic sensors, MEMS and microengineering. He has been an Australian Government advisor on microelectronics for the ASEAN region and, on behalf of his University, the Government and UNESCO, has conducted many specialist microelectronics courses in Australia and six overseas countries. Professor Haskard is a Fellow of three Institutions, namely the Institution of Engineers Australia, the Institution of Radio and Electronics Engineers (Australia) and the Institution of Electrical Engineers (London), and a member of the International Microelectronics and Packaging Society. He has published nine books.

Keith Pitt graduated from the University of London in 1953 with an Honours Degree in Chemistry. He was awarded an MPhil. from Middlesex University in 1987. He joined Middlesex University in 1971 after spells with the Philips, Morganite and GEC groups. After recent retirement as Reader in Microelectronics Manufacturing and Deputy Head of Middlesex University Microelectronics Centre, he is now a Visiting Academic in the University with research interests in thick-film microwave technology, thermal design and reliability of electronics systems.

Table of Contents

CHAPTER ONE

Introduction to Thick-film Technology

1.1 An Overview of the Thick-film Process

1.2 Comparison with Other Technologies

1.3 Exercises

CHAPTER TWO

Process Technology

2.1 Screen Printers and the Printing Process

2.2 Screens and Their Fabrication

2.2.1 Screen Frames

2.2.2 Screen Mesh

2.2.3 Emulsions

2.3 Thick-film Screen Printing

2.4 The Drying Process

2.5 Thick-film Firing

2.6 Thick-film Resistor Trimming

2.6.1 Laser Trimming

2.6.2 Air Abrasive Trimming

2.6.3 Active Trimming

2.7 Soldering to Thick-films

2.8 Typical Hybrid Thick-film Substrate Process Sequence

2.9 Exercises

CHAPTER THREE

Pastes and Substrates

3.1 Paste Rheology

3.2 Paste Fabrication and Constitution

3.3 Background to Materials for Thick-film Pastes and Substrates

3.4 Substrates

3.4.1 Alternatives to Alumina

3.5 Conductors

3.6 Dielectrics

3.7 Resistors

3.8 Base Metal Thick Film Systems

3.9 Polymer Thick-film Technology

3.9.1 Summary of Polymer Thick-film Technology

3.10 Exercises

CHAPTER FOUR

Thick-film Components

4.1 Paste and System Selection

4.1.1 Selection of Conductor Pastes

4.1.2 Selection of Resistor Pastes

4.1.3 Selection of Dielectric Pastes

4.2 Multilayer Circuits

4.3 Print or Use a Chip Component?

4.4 Thick-film and Hybrid Reliability

4.4.1 Reliability and Time

4.4.2 Reliability and Temperature

4.4.3 Physical Prediction of High Yield and High Reliability

4.5 Exercises

CHAPTER FIVE

Assembly, Packaging and Testing

5.1 Chip Assembly

5.1.1 Passive Chip Components

5.1.2 Semiconductor Components

5.2 Packaging

5.3 Multichip Modules

5.4 Testing

5.5 Exercises

CHAPTER SIX

Cleanliness, Quality and Safety

6.1 Clean Rooms

6.2 Quality Materials

6.3 Safety

6.4 Process Control

6.5 Exercises

CHAPTER SEVEN

Circuit Design and Applications

7.1 Component Types

7.2 Printed Width and Spacing

7.3 Scaling Components and Aspect Ratios

7.4 Typical Layout Rules

7.5 Design Concepts

7.5.1 Design Considerations for Resistors

7.5.2 The Design of Capacitors

7.5.3 Designing Inductors

7.5.4 Designing with Chip Components

7.6 Computer-aided Design

7.6.1 CAD Systems

7.6.2 A Design Strategy when Using CAHL

7.7 Thermal Aspects of Hybrids

7.7.1 Thermal Analogues of Electrical Behaviour

7.7.2 Fixed Angle Model

7.7.3 Thermal Analysis

7.8 Exercises

CHAPTER EIGHT

Thick-film Sensors

8.1 Sensors Using Circuit Techniques

8.2 Sensors Based on Special Pastes

8.3 Sensors Based on Standard Pastes

8.3.1 Temperature Sensors

8.3.2 Piezo-resistance Sensors

8.3.3 Liquid Sensors

8.3.4 Gas Detection

8.4 Other Related Devices

8.4.1 Fast-acting Thick-film Fuses

8.4.2 High-voltage Isolation

8.5 Exercises

CHAPTER NINE

High Speed and Microwave Thick-film Hybrids

9.1 High Frequency Models of Thick-film Components

9.2 Capacitance of Parallel Tracks

9.3 Inductors in High Frequency Circuits

9.4 Microwave Circuits

9.4.1 Lumped Element Approach

9.4.2 Distributed Element Approach

9.4.3 Characteristic Impedances

9.4.4 Comparison of Metal Tracks at Microwave Frequencies

9.5 Achievement of Microwave Structures using Thick-film Technology

9.5.1 Substrates

9.5.2 Conductor Materials

9.5.3 Printing Technology

9.5.4 Other Processing and Environmental Considerations

9.5.5 Surface Mounted Components

9.6 Alternative Process Technologies

9.7 Concluding Comments

9.8 Exercises

CHAPTER TEN

Recent Developments

10.1 The Growing Uniformity of Thick-film Products

10.2 Thick-film Chemical Sensors

10.3 Ferroelectric Thick-films

10.4 Ferromagnetic Thick-films

10.5 High Temperature Superconductors

10.6 Exercises

APPENDIX A

CAHL—Computer Aided Hybrid Layout Software

APPENDIX B

Instructions on the Use of CAHL Software

 

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 Page last revised 11.02.05

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