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Code: EP33 Contents of this page:Description DescriptionFlexible circuits and their predecessors flat wire cables have been solving electronics packaging problems for more than half a century, yet this highly useful technology has only in recent years gained a serious following. The term ‘flexible’ is particularly appropriate as it describes not only the physical capabilities of the technology but also its technological capabilities as it can solve problems for every type of product and at every level of reliability from children’s toys and hand-held calculators, to space flight hardware and implantable heart pacemakers. Still, there are many subtleties to this important technology that must be understood by the would-be user which, if ignored, are capable of causing undesirable manufacturing, assembly and/or reliability problems. This book seeks to guide the reader through the many important choices that must be made to enjoy the many benefits flexible circuit technology has to offer. A complete range of topics related to flex circuits is covered in the text including: an overview of flexible circuit technology, a review of representative and unusual flexible circuit applications, materials used in the fabrication of flexible circuits, a review of the important steps to be considered in implementing flex circuits, a thorough review of practical design guidelines and design practices for flex circuits, manufacturing methods for flex circuits, a review of approaches to assembly, inspection and testing of flex circuits and documentation requirements for flex. The book is designed to help the would-be user quickly grasp when, where and how flexible circuits are best used as well as providing a full understanding of the fundamentals of flexible circuit technology, from materials and design through to manufacture and assembly. This text is highly recommended for design and electronic packaging engineers, project managers, systems designers and quality assurance engineers. In short, this book is for any individual who might be involved in the packaging decision making process or is simply interested in increasing his options for meeting the demands of electronic packaging in the future. About the authorJoseph Fjelstad is a consultant and senior engineer with Tessera, a recognised leader in flex circuit based chip scale packaging. Prior to joining Tessera in 1994, he was a full time consultant in electronic interconnection manufacturing technology with more than 25 years of national and international experience in the industry including nearly a year at a research centre near Moscow, Russia. In his earlier career he worked as an analytical chemist, laboratory supervisor, manufacturing chemist, process engineer, R&D manager and also served as Educational Director of the Institute for Interconnecting and Packaging Electronic Circuits (IPC). Mr Fjelstad is the inventor or co-inventor of four U.S. patented inventions and currently has more than 15 other U.S. invention patents pending. He has written, presented and published numerous papers on electronics fabrication and currently writes a monthly column on flex circuits for ‘Circuitree Magazine’. A frequent instructor at industry workshops, Mr Fjelstad has authored or co-authored five different books on electronics fabrication prior to writing this one. A recipient of the IPC Presidents Award for outstanding contribution to the electronics industry and the programmes of the IPC, he is presently serving as General Chairman of the IPC Design Committee as well as serving on the board of editorial advisors of Electronic Packaging and Production magazine. Table of Contents
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