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Code: EP36 Contents of this page:Description DescriptionThis book presents state-of-the-art knowledge of conductive adhesive joining technology in various electronics packaging applications. It is divided into four parts. Firstly, the book gives an introduction to conductive adhesives and joining technologies. Secondly, several chapters deal with fundamental issues of materials selection and manufacturing, processing, conduction mechanisms and contact reliability theories associated with the use of conductive adhesives. Both isotropically and anisotropically conductive adhesives are included. After these the book focuses on the various applications using conductive adhesives such as in surface mount, die-attach, display and flip-chip. Finally, the toxicity and environmental health aspects are investigated. ‘Conductive Adhesives for Electronics Packaging’ can be used as a reference book for design, production and quality engineers, decision makers and research scientists who are, or wish to be, engaged in electronics packaging research and development using conductive adhesive joining technology. About the EditorJohan Liu received his masters degree in materials science and engineering from the Royal Institute of Technology, Stockholm, Sweden in 1984. He also received his PhD there in 1989 in the area of rapid solidification technology. He has been with IVF since 1989. As a member of the management team for the IVF Electronics Packaging Research Division, he is responsible for the research of interconnection technology at IVF and runs a number of multi-client research programmes including conductive adhesive joining, chip-on-board and lead-free solders. He is also docent in the Chalmers University of Technology, Gšteborg, Sweden, where he supervises and teaches PhD students. Dr Liu serves as the European editor of the Journal of Electronics Manufacturing, is vice chairman of the technical committee of the international conference on ‘adhesives in electronics’, a member of the international programme liaison committee for the Interpack'97 Conference, European liaison chair for the American VLSI Computer and System Packaging Workshop and general chair of the first IEEE International Symposium on Polymeric Electronics Packaging. He is a senior member of IEEE, a member of ISHM and The Institute of Welding and Materials Research Society. He also chairs the IEEE CPMT Sweden Chapter. He has presented a number of invited papers and tutorials at international conferences in the area of conductive adhesive joining technology and has twice been guest editor for the Journal of Electronics Manufacturing. Recently Dr Liu received the best paper award 1996 from the IEEE Transactions of CPMT, Part B: Advanced Packaging, for a paper entitled ‘Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates’, and he has received numerous awards throughout his career for work and leadership involving conductive adhesives in electronics packaging. Table of Contents
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