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Code: EP134

Description

Printed board design and layout is the key to Zero Defect Manufacture and this CD-ROM provides a basic introduction to Conventional, Surface Mount, Ball Grid Array and Pin In Hole/Intrusive Reflow Assembly.

The interactive CD-ROM contains the following guidelines:

• Conventional and surface mount layout;

• Surface mount and conventional footprints;

• Resist, via hole, tracking and panel layout;

• Solder paste stencil rules;

• Printed board specifications.

A brief introduction to printed board manufacture is provided along with guidelines on the correct specification of printed boards for fine pitch surface mount applications. This is ideal for engineers who need a basic introduction to circuit fabrication.

The defect guide browser provides photographic examples of defects or poor design rather than defect categories which makes it easy to compare potential problems with the disk content. Clicking on the photograph provides a full screen view with an explanation of the possible causes.

Two full animations of the surface mount and conventional assembly processes are included on the disk which includes the BGA, double sided assembly and through hole/intrusive reflow conventional assembly and wave soldering. This section features a commentary by Bob Willis, one of the UK’s leading process engineers, or it can be viewed with just a text guide.