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MULTILAYER BONDING GUIDE

by M. Huschka

Pages--130 + ix; Tables--23; Figures--148; Size--23 x 15 cm.
ISBN 1 872422 00 4

 REFERENCE BOOKS

Code: EP41

Contents of this page:

Description
About the author
Table of Contents

Description

This comprehensive treatise on the bonding of multilayers offers detailed information and guidance to those involved in the growth area of multilayer manufacture. Manfred Huschka, author and lecturer of note, brings to his subject the wide-ranging knowledge and expertise gained at the sharp end of implementing this technology. The book provides manufacturers with detailed information concerning the options open to them and informed comparison of the various methods employed. Chapters focus on: Multilayer Constructions, Bonding Preparations,Lay-up of Multilayer Stacks, Multilayer Presses, Press Cycles, Multilayer Troubleshooting and Test Methods.

About the author

Manfred Huschka obtained his degree at the College of Engineering in Aalen, Germany, where he studied Chemistry and Surface Technology/Materials Technology.

After working for five years as a manufacturing engineer on PCB production and electroplating, he subsequently worked for Norplex Oak Europa (later to become AlliedSignal Laminate Systems Europe) for 13years in various functions - Technical Service Manager, Mass Lamination Manager, Technical Marketing Manager, and also Director Technology, Europe. Since 1997 Manfred Huschka is with Taconic Advanced Dielectric Division, where his current position is General Manager Europe.

Mr. Huschka is the author of more than 30 technical papers on the subject of high technology substrates for the PCB industry and has lectured extensively at national and international events. He is also the author of 5 technical books about printed circuit boards.

The original version of this book was published in the German language in 1988 by Eugen G. Leuze Verlag under the title "Einführung in die Multilayer-Presstechnik". The text has been up-dated in the intervening period for this English language edition.

Table of Contents

PREFACE

CHAPTER ONE

Multilayer Constructions

1.1 Thin Laminates

1.1.1 Laminate Constructions

1.1.2 Dimensional Stability

1.2 Prepregs

1.3 Copper Foils

1.4 Multilayer Constructions

1.4.1 Basic Considerations

1.4.2 4-Layer Multilayer,1.5/1.6 mm (0.059-0.063 in.) Final Thickness

1.4.3 6-Layer Multilayer,1.5/1.6 mm (0.059-0.063 in.) Final Thickness

1.4.4 8-Layer Multilayer,1.5/1.6 mm (0.059-0.063 in.) Final Thickness

1.4.5 Multilayer with More Layers or Greater Final Thickness

CHAPTER TWO

Bonding Preparations

2.1 Preconditioning of Prepregs

2.2 Preconditioning of Inner and Outer Layers

2.3 Tooling Systems

2.3.1 Basic Information

2.3.2 The 2 (or 3) Hole Tooling System

2.3.3 The 4-Slot Tooling System

2.3.4 Other Tooling Systems

2.3.5 Tooling Holes

CHAPTER THREE

Lay-up of a Multilayer Stack

3.1 Press Tools

3.2 Separator Plates

3.3 Press Padding

3.4 Tooling Pins

3.5 Release Films

3.6 Cleanliness

3.7 Construction of a Multilayer Stack

3.8 Lay-up

 CHAPTER FOUR

Multilayer Presses

4.1 Basic Information

4.2 Basic Requirements

4.2.1 Hydraulics

4.2.2 Parallelism of Press and Press Platens

4.2.3 Accuracy of Press Load

4.2.4 Uniformity of Temperature Distribution

4.2.5 Cooling Systems

4.2.6 Control Systems

4.3 Heating Systems

4.3.1 Electrically Heated Presses

4.3.2 Oil Heated Presses

4.3.3 Steam Heated Presses

4.4 Hot Transfer Presses

4.5 Vacuum Presses

4.5.1 Basic Information

4.5.2 Areas of Application

4.5.3 Hydraulic Vacuum Presses

4.5.4 Vacuum Autoclave

4.5.5 Vacuum Autoclave vs Hydraulic Vacuum Press

4.5.6 Vacuum Frames

4.5.7 Vacuum Bags

4.6 Handling Systems

CHAPTER FIVE

Press Cycle

5.1 Single-stage Press Cycle

5.2 Two-stage Press Cycle

5.3 Cold Start/Hot Start

5.4 Press Cycle

5.5 Bonding of No-flow Prepregs

5.6 Bonding of Multilayers with Buried Via-holes or Metal Cores

5.7 Depinning/Separation of Multilayer Stacks/Edge Milling

CHAPTER SIX

Multilayer Troubleshooting

6.1 Chronic Misregistration After Bonding (Not Inner Layer Instability)

6.2 Layer Misregistration Due to Inner Layer Instability

 6.3 Warp and Twist of Multilayers

6.4 Voids (Air or Moisture in Prepreg Areas)

6.5 Out-of-tolerance Multilayer Thickness

6.5.1 High Centres or Low Edges

6.5.2 Tapered Multilayers

6.5.3 Uniformly Low or High Multilayer Thickness

6.5.4 High Spots

6.5.5 Some Multilayers are High, Some Low

6.6 Circuit Image Transfer from 2nd Conductor Layer to Surface Layer (Telegraphing)

6.7 Haziness in Prepreg Areas, Visible especially after Etching

6.8 Surface Defects

6.8.1 Pits and Dents

6.8.2 Resin Spots

6.9 Delamination or Blistering During Subsequent Processing, e.g., Post Baking and Reflow

CHAPTER SEVEN

Test Methods

7.1 Test Standards

7.2 Prepreg Test Methods

7.2.1 Resin Content

7.2.2 Resin Flow

7.2.3 Scaled Flow Pressed Ply Thickness

7.2.4 Resin Flow of No-flow Prepreg

7.2.5 Gel Time

7.2.6 Volatile Content

7.3 Laminate Test Methods

7.3.1 Mechanical Tests

7.3.2 Visual Tests

7.3.3 Chemical Tests

7.4 Multilayer Test Methods for Bonding Quality

GLOSSARY OF TERMS

BIBLIOGRAPHY

USEFUL ADDRESSES

INDEX

 

 

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 Page last revised 11.02.05

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