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Code: EP129

Description

This CD-ROM provides the process or quality engineer with a source of photographs of process defects which may be used in company inspection documents or presentations. They may be simply pasted into any document for in house company use. Each photograph is provided as a .Tiff file format.

The disk includes examples of the following:

Chip Leaching, Poor Solderability, Plastic Cracking, BGA Misplacement, BGA Cracking, Capacitor Cracking, Plastic Softening, QFP Cracking, Solder Beading, Crystallised Joints, Cracked Joint, Poor Pad Wetting, Component Lift, No Wetting, Joint Failure, Joint Voiding, Solder Wicking, Component Lifting, Solder Short, Non Reflow, PCB Measeling, Poor Penetration, Solder Skip, Bulbous Joint, Blow Hole, Solder Webbing, Adhesive Contamination, Adhesive Stringing, Excess Adhesive, Misplaced Lead, Misplaced Component, Dendrite Growth, Corrosion, Solder Spikes, Flux Residues, Joint Cracking, Pad Lifting etc.