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Code: EP131

Description

This CD ROM provides the process or quality engineer with a source of photographs of assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Over 130 photographs produced by Bob Willis are provided as a TIFF file format.

The disk includes examples of the following:

BGA Component Types, Pad Types, Via Mounting, Resist Apertures, Pasted Boards, Solder Joints on Surface and Via Mounted, Delamination of Die. X-Ray Images of Voiding, Missing Balls, Short Circuits and Non Reflow.