|
| |
SUBCONTRACTING ELECTRONICS
A Management and Technical Guide for
Purchasers and Suppliers
by David Boswell
Pages--268+xv; Tables--14;
Figures--22; Size--23 x 15 cm.
ISBN 0 07 707783 0
|
|
Code: EP53
Contents of this page:
Description
About the author
Table of Contents
This book provides senior executives and managers and contract
negotiators involved in electronic purchase and supply decisions
with comprehensive and practical guidance in electronics
subcontracting. The increasing complexity of system design and
assembly needs a more professional approach from both customer
and supplier, and the reader is taken from start to finish
through each step of the contracting process. The differing
viewpoints and standards of both sides are set out and discussed
in areas such as costing methods, terms and conditions of sale
and purchase, and make or buy decision making.
David Boswells approach to the subject is highly
practical, and checklists of questions to consider and
common pitfalls to be avoided are provided throughout. The
book concludes with three compound case histories that highlight
various possible dangers. Although the principles of
subcontracting are illustrated through surface mount technology,
the material in this factual book is equally applicable to all
electronic equipment assembly techniques.
Special features
 | Step-by-step guidance to the whole subcontracting process |
 | Authoritative discussion of management issues in a
technical context |
 | A clear explanation of todays electronic assembly
options with advantages and disadvantages of each |
 | Practical approach, including pitfall avoidance and case
histories |
David Boswell is Chairman of the UK Surface Mount Club. He is
a consultant and a specialist in surface mount subcontracting. He
is the principal co-author, with Martin Wickham, of Surface Mount
Guidelines for Process Control, Quality and Reliability.
Table of Contents
Chapter 1
The electronics industryChapter 2
Key factors in surface mount make or buy
decisions
Chapter 3
Contracts, terms and conditions of purchase and sale
Chapter 4
Assembly technology options, advantages and
disadvantages
Chapter 5
Design checks before subcontracting SM assemblies
Chapter 6
Design checks before subcontracting hybrid
circuits
Chapter 7
Surface mounted components and assembly materials
Chapter 8
Printed boards
|
Chapter 9
Components supplied by the customerChapter
10
Checking designs for manufacturability, test and
reliability
Chapter 11
Specifying the product and defining the basis for
quote
Chapter 12
Choosing a printed board layout design
subcontractor
Chapter 13
Choosing an assembly subcontractor
Chapter 14
Choosing a customer: the subcontractors viewpoint
|
Chapter 15
Assessing and auditing a subcontractors
assembly and test activityChapter 16
Rework and repair
Chapter 17
Surface mount field reliability issues
Chapter 18
Maintaining good relations
Chapter 19
Costing board assemblies
Chapter 20
Compound case-histories
Chapter 21
Definitions and abbreviations
Chapter 22
Sources of assistance and bibliography
|
Tel: +44 (0)1624 834941
Fax: +44 (0)1624 835400
E-Mail: sales@elchempub.com
© Electrochemical Publications, IOM,
1997-2005
|

|
Page last revised 11.02.05 |
|