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SUBCONTRACTING ELECTRONICS

A Management and Technical Guide for Purchasers and Suppliers

by David Boswell

Pages--268+xv; Tables--14; Figures--22; Size--23 x 15 cm.
ISBN 0 07 707783 0

REFERENCE BOOKS

Code: EP53

Contents of this page:

Description
About the author
Table of Contents

Description

This book provides senior executives and managers and contract negotiators involved in electronic purchase and supply decisions with comprehensive and practical guidance in electronics subcontracting. The increasing complexity of system design and assembly needs a more professional approach from both customer and supplier, and the reader is taken from start to finish through each step of the contracting process. The differing viewpoints and standards of both sides are set out and discussed in areas such as costing methods, terms and conditions of sale and purchase, and ‘make or buy’ decision making.

David Boswell’s approach to the subject is highly practical, and checklists of questions to consider and common pitfalls to be avoided are provided throughout. The book concludes with three compound case histories that highlight various possible dangers. Although the principles of subcontracting are illustrated through surface mount technology, the material in this factual book is equally applicable to all electronic equipment assembly techniques.

Special features

Step-by-step guidance to the whole subcontracting process
Authoritative discussion of management issues in a technical context
A clear explanation of today’s electronic assembly options with advantages and disadvantages of each
Practical approach, including pitfall avoidance and case histories

About the author

David Boswell is Chairman of the UK Surface Mount Club. He is a consultant and a specialist in surface mount subcontracting. He is the principal co-author, with Martin Wickham, of Surface Mount Guidelines for Process Control, Quality and Reliability.

Table of Contents

Chapter 1
The electronics industry

Chapter 2
Key factors in surface mount ‘make or buy’ decisions

Chapter 3
Contracts, terms and conditions of purchase and sale

Chapter 4
Assembly technology options, advantages and disadvantages

Chapter 5
Design checks before subcontracting SM assemblies

Chapter 6
Design checks before subcontracting hybrid circuits

Chapter 7
Surface mounted components and assembly materials

Chapter 8
Printed boards

Chapter 9
Components supplied by the customer

Chapter 10
Checking designs for manufacturability, test and reliability

Chapter 11
Specifying the product and defining the basis for quote

Chapter 12
Choosing a printed board layout design subcontractor

Chapter 13
Choosing an assembly subcontractor

Chapter 14
Choosing a customer: the subcontractor’s viewpoint

Chapter 15
Assessing and auditing a subcontractor’s assembly and test activity

Chapter 16
Rework and repair

Chapter 17
Surface mount field reliability issues

Chapter 18
Maintaining good relations

Chapter 19
Costing board assemblies

Chapter 20
Compound case-histories

Chapter 21
Definitions and abbreviations

Chapter 22
Sources of assistance and bibliography

 

 

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© Electrochemical Publications, IOM, 1997-2005

 Page last revised 11.02.05

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