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PIN IN HOLE/INTRUSIVE REFLOW DESIGN
& ASSEMBLY
by Bob Willis
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Code: EP93
Description
This video contains the following topics:
 | PCB Design and Component Requirements |
| Possible Assembly Stages |
| PIHR Advantages and Disadvantages |
| Paste Application by:
Stencil Printing;
Double Stencil Print;
Paste Dispensing. |
| Stencil Aperture Calculations |
| Solder Pallet Support |
| Reflow Soldering Profiles |
| Inspection Requirements |
| Microsection Analysis |
| Evaluation Results |
| Process Defects |
Tel: +44 (0)1624 834941
Fax: +44 (0)1624 835400
E-Mail: sales@elchempub.com
© Electrochemical Publications, IOM,
1997-2005
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Page last revised 11.02.05 |
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