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ELECTRONIC CIRCUIT CARDS AND SURFACE MOUNT TECHNOLOGY

A Guide to their Design, Assembly and Application

by Malcolm R. Haskard

Pages--227 + xii; Tables--40; Figures--168; Size--235 x 155 cm.
ISBN 1 872422 05 5

REFERENCE BOOKS

Code: EP55

Contents of this page:

Description
About the author
Table of Contents

Description

Providing a detailed overview of electronic circuit card design and manufacture, this book contains details of Standards, layout of cards, materials and processes used, testing and ordering of components, as well as management of the process. Information is also given on solder and soldering processes, both manual and automated.

Features include:

• A complete overview of design, manufacture, testing, and process management of electronic circuit cards, including new directions.

• Flow charts for many processes including manual and automatic operations, through-hole, and surface mount boards.

• Tables which compare processes and materials.

Consideration is also given to health, safety, and environmental aspects.

About the author

Malcolm Haskard was Professor of Microelectronics, Head of the School of Electronic Engineering and Founding Director of the Microelectronics Centre at the University of South Australia. He retired in late 1996 and now assists the University and Microelectronics Centre as an Adjunct Professor. His research interests include microelectronic sensors, MEMS and microengineering. He has been an Australian Government advisor on microelectronics for the ASEAN region and, on behalf of his University, the Government and UNESCO, has conducted many specialist microelectronics courses in Australia and six overseas countries. Professor Haskard is a Fellow of three Institutions, namely the Institution of Engineers Australia, the Institution of Radio and Electronics Engineers (Australia) and the Institution of Electrical Engineers (London), and a member of the International Microelectronics and Packaging Society. He has published nine books.

Table of Contents

Chapter 1

Introduction to circuit cards

1.1 An overview

1.2 Related technologies

1.3 Alternative technologies

1.4 Surface mount technology

1.5 Comparison of the manufacturing technologies

1.6 Questions

1.7 References

Chapter 2

Printed circuit board technology

2.1 Introduction

2.2 Steps in manufacturing a basic board

2.2.1 Manufacture of copper-clad laminate

2.2.2 Cleaning of boards

2.2.3 Photolithography

2.2.4 Etching of the board

2.2.5 Board drilling

2.2.6 Coatings

2.3 Other printed board processes

2.4 New materials and technologies

2.5 Questions

2.6 References

Chapter 3

Solder and the soldering process

3.1 Introduction

3.2 Electronic grade solder

3.2.1 Solder alloy

3.2.2 Fluxes

3.2.3 Solder for hand soldering

3.2.4 Solder creams and pastes

3.3 The soldering process

3.3.1 Preparation

3.3.2 Soldering variables

3.3.3 Soldering processes

3.4 Hand soldering

3.4.1 Hand tools

3.4.2 Steps in hand soldering

3.5 Wave soldering

3.6 Vapor phase reflow soldering

3.7 Infrared reflow soldering

3.8 Laser soldering

3.9 Solder joint assessment

3.10 Questions

3.11 References

Chapter 4

Non-soldering joining methods

4.1 Introduction

4.2 Microwelding

4.3 Wire bonding

4.4 Wire-wrap

4.5 Crimped joints

4.6 Screw joint

4.7 Chemical bonding

4.8 Questions

4.9 References

Chapter 5

Electronic components

5.1 Introduction

5.2 Passive components

5.2.1 Resistors

5.2.2 Capacitors

5.2.3 Inductors

5.2.4 Packaging

5.3 Semiconductor components

5.4 Wires

5.4.1 Interconnect or ‘hook up’ wire

5.4.2 Enamel wire (or magnet wire)

5.4.3 Litz wire

5.4.4 Tinned copper wire

5.4.5 Coaxial and shielded cables/wires

5.4.6 Ribbon and multiwire cables

5.4.7 Looming of cables

5.5 Other components

5.6 Component reliability

5.7 Questions

5.8 References

Chapter 6

Stencil and screen printing

6.1 Introduction

6.2 The basic process

6.3 Solder paste/cream application

6.4 Printing of polymer paste components

6.4.1 Introduction

6.4.2 Screen printing

6.4.3 Polymer pastes

6.4.4 Layout of components

6.5 Epoxy glue—alternatives

6.5.1 Pneumatic syringe dispensers

6.5.2 Pin mass transfer

6.6 Questions

6.7 References

Chapter 7

Assembly of circuit boards

7.1 Introduction

7.2 Leaded through-hole assembly

7.2.1 Manual methods

7.2.2 Automatic methods

7.3 Surface mount assembly

7.3.1 Manual assembly

7.3.2 Automatic assembly

7.4 Mixed technology

7.5 Soldering to posts and connectors

7.5.1 Mounting and soldering to terminals/posts

7.5.2 Connector cup terminal soldering

7.6 Health and safety

7.6.1 Chemical hazards

7.6.2 Physical hazards

7.7 Questions

7.8 References

Chapter 8

Inspection and testing of cards

8.1 Introduction

8.2 Board faults

8.3 Board inspection

8.4 Board testing

8.4.1 Bare board testing

8.4.2 Incircuit testing

8.4.3 Functional testing

8.4.4 Built in tests

8.5 Testing after manufacture

8.5.1 Burn in

8.5.2 Life tests

8.6 Rework and repair

8.6.1 Component removal

8.6.2 Component replacement

8.6.3 Terminal removal

8.7 Questions

8.8 References

Chapter 9

Production methods

9.1 Introduction to computer integrated manufacture

9.2 Flexible manufacturing systems

9.3 Establishing a manufacturing system

9.4 Just in time strategy

9.5 Component storage

9.6 A clean assembly environment

9.7 Electrostatic protection

9.8 Questions

9.9 References

Chapter 10

Design of a circuit card

10.1 Introduction

10.2 Layout of a card

10.2.1 Electrical considerations

10.2.2 Thermal considerations

10.2.3 Mechanical considerations

10.3 Manual layouts

10.4 Computer aided design methods

10.5 Questions

10.6 References

Chapter 11

Extensions of the technology

11.1 Introduction

11.2 Printed circuit inductors

11.3 Stripline techniques

11.4 Sensors

11.4.1 Capacitive based sensors

11.4.2 Resistive based sensors

11.5 Questions

11.6 References

Appendices

Appendix A

Soldering practice boards

Appendix B

Student soldering exercises

B.l Logic probe

B.2 Power supply

B.3 Function generator

 

 

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 Page last revised 11.02.05

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