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Code: EP95

Description

This video lecture traces the requirements for packaging and chip protection, giving insight to the origins of the safeguards required and the developments therefrom. The discussion covers the impact of the evolution of silicon planar technology from transistors to integrated circuits on the early proliferation of package types leading to the establishment of the dual-in-line package as the standard package type for small scale integrated circuits. The constraints on the development of cost-effective technologies, arising from the early insistence of hermeticity create a pattern that is repeated as packages move from simple to complex. Thus, the consistent trend is seen to be the move from (costly) hermetic towards low cost plastic, starting with the alternative technologies of the ceramic dual-in-line package (CerDIP) and thence the plastic DIP (PDIP). The early problems with plastic packaging are seen to have been solved and the PDIP accepted as the most widely used reliable standard package for more than two decades, and thus any residual prejudice against the use of plastic packaging in high reliability applications is seen to be outmoded. The parallel developments of chip protection, through passivation, overglaze, metallisation, and their links with package related reliability problems and solutions are examined.

The trends and driving forces towards higher density packaging leading to the developments of hybrid microelectronics and surface mount micropackaging, are introduced. The presentation examines JEDEC standardisation and the trend versus cost impasse, solved by the initiatives by British Telecom to show that low-cost high-reliability micropackaging was possible and practical. The EPIC (low cost, high performance) plastic chip carrier and the low cost C-Quad ceramic chip carrier are illustrated. Reliability findings from a range of micropackages are discussed, showing the advanced state of reliability development, allowing the use of the packages even in severe tropical climates.