Products  About us   Prices  Order  Search  Potential authors  Links  Contacts  Mailing

     Books   Manuals   Reports   Videos   CD-ROMs

Code: EP96

Description

Following the encouragement, in the first video, of the use of plastic encapsulation, this lecture deals with the materials, and advantages and possible disadvantages of encapsulating integrated circuits. The factors to be considered in selecting materials, dependent on environmental and functional constraints, are dealt with. The options for encapsulation are introduced and the specific properties required of the consequent finished encapsulants are covered in some detail. The properties and structures of different types of polymer are described and the manner of testing these properties - thermal expansion, glass transition temperature, rheology, structure and composition, ionic content - are detailed. The composition and application of various types of polymer - epoxies, silicones, polyimides and parylene - are described. The practical application of these materials in die protection - die (junction) coating, moulding, "glob top" protection - is considered. Finally, in anticipation of the need for quality and failure analysis, the techniques of encapsulant removal are described.