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METHODS AND EQUIPMENT FOR PLASTIC ENCAPSULATION

Presented by John Hull

Running Time: 1.5 hours

BASICS OF PACKAGING AND INTERCONNECTION

Code: EP97

Description

This video lecture serves as an introduction to the basics of transfer moulding, dealing with: devices, moulding compounds, hand moulding and production moulding. The range of different types of moulds and their concepts are covered. Post moulding operations are described, such as deflashing, trimming and lead forming, and testing and marking. Special techniques including vacuum venting, positioning pins, liquid transfer encapsulation, liquid casting and conformal coating are also described. The lecture concludes with special encapsulations such as glob top and moulding for Tape Automated Bonding, transfer moulding and conformal coating of hybrid microcircuits, and liquid casting and transfer moulding for Opto-electronics devices.

 

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 Page last revised 11.02.05

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