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Code: EP98

Description

This lecture examines the types and technologies of packages that may be hermetically sealed. These include the CerDip soft glass sealed packages, the higher temperature processed packages sealed with hard glass-to-metal seals, the co-fired ceramic packages with side-brazed leads, and the ceramic based integral substrate packages typically constructed with the aid of thick film technologies. Various sealing processes include glass fusion in furnaces to seal the low melting point glasses for CerDIP and C-Quad packages, soldering - fluxed and non fluxed - using base and noble metal solders to seal metal lidded packages, and projection and seam electrical welding of metal packages. Briefly considered also are the merits of electron beam and laser beam welding. The lecture concludes by addressing the necessary steps to ensure good quality in achieving good joins and the assessments of hermeticity to be undertaken.