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Code: EP99

Description

In this video lecture, trends towards greater complexity in ICs and their impact on pin count and packaging are examined. The consequent development of Pin Grid Arrays, and high density packaging options are presented. The growth and penetration of micropackages based on published analyses are forecast, and are expected to impact on developments of hybrid microelectronics, tape automated bonding, and multi-chip modules. The case is presented for a new approach to achieve cost-effective life cycle costing following the developments in micropackaging and the evidence and achievements of high reliability from low cost packages