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HYBRID CIRCUIT TECHNOLOGIES AND APPLICATIONS

[THIN FILMS]

Presented by Prof. Andre Van Calster

Running Time: 1.5 hours

BASICS OF PACKAGING AND INTERCONNECTION

Code: EP100

Description

The achievement of complex high density microelectronics is serviced most effectively by the technologies of thin film and thick film which can result in compact, high performance passive and active microcircuits.

While thin film devices occupy a smaller fraction of the market for hybrids, the growth in particular applications such as displays has caused an increasing demand for thinfilm circuits. The lecture systematically addresses the application areas for thin films, then the deposition technologies - physical and chemical - in considerable detail, including pattern forming by photolithography. The deposition of conductors, resistors and insulators is covered as well as the range and properties of materials and substrates. Also presented is the physics of thin films - nucleation and growth, mechanical stress and adhesion transport properties and diffusion. The products of processing thin films are the devices, i.e., resistors, transistors, hybrids and multi-chip modules with applications in many fields, with special emphasis on displays in this lecture.

 

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 Page last revised 11.02.05

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