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Code: EP101

Description

The achievement of complex high density microelectronics is serviced most effectively by the technologies of thin film and thick film which can result in compact, high performance passive and active microcircuits.

Thick film hybrid circuits presently dominate the market for hybrid microelectronics. The lecture first considers the markets and their implications and provides some examples of the range of applications of thick film circuits. The advantages in robustness, reliability and range of thick films are considered and the versatility in processing described. The presentation covers cermet thick film processing for general and fine-line requirements. The discussion includes conventional and alternative conductors and dielectrics, and the range of resistors. A detailed examination of processing parameters - composition, screen printing, and firing - is presented. The tolerance is illustrated. The alternative, low cost, polymer thick films and their applications are also covered. The thick film circuit functionality may be increased by the addition of surface mounted passive components. Complexity may be increased with active components either in bare chip form or with the use of micropackaged components assembled on the surface. The active hybrids may be further adjusted by "functionally trimming" selected resistors. Sequences are shown to illustrate the use of computer aided design (CAD), essential to generate resistors from the wide range of thick film resistor pastes available and for realisation of complex hybrids. The sequences show the generation of artwork and screen making required to apply the thick film patterns.