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Code: EP102

Description

Having created the micropackaged ICs and complex hybrid circuits, the realisation of equipment requires the interconnection of these various circuits onto a common circuit board, hence the Printed Wiring Board. The lecture leads the viewer from the basic types of printed circuit board, from conventional, through plated through hole boards, to flexibles and flexi-rigids. Design methods in creating artworks and preparation of phototools are dealt with. Subtractive and additive technologies are addressed. The various laminates - epoxy, polyimide, etc - and the reinforcements are described and benefits considered. The full range of processes - drilling, plating, photolithography, pattern plating, etching, lamination, etchback — are presented systematically. Wearout mechanisms are also described and advanced solutions to accommodate mismatch of expansion coefficients for surface mounted assemblies are presented. The presentation concludes with the lecturer’s recommended choices of package and substrate for various package pin counts.