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Code: EP104

Description

Joining in electronics is involved at all levels in the hierarchy of electronics assemblies. Chip connection commences with die-bonding, for which techniques are described for eutectic, low temperature glass, solder and adhesive attachment. Particular attention is given to aspects of adhesive die bonding and the associated assembly stages. A range of equipment is described and a useful reference table provided. Quality control by cleanliness, machine control and alignment, and also assessment techniques, both destructive - shear testing, die removal, microsectioning - and non-destructive — X-Radiography, thermal analysis - are described.

This lecture on Second Level interconnection concentrates on wire-bonding (other lectures cover other techniques). Ball and wedge bonding descriptions include stress flow patterns and thermocompression, thermosonic, ultrasonic and split-tip techniques using either gold or aluminium wires. Intermetallic (Au-Al) problems are clarified and solutions offered. The lecture moves on to techniques developed to enable ball bonding of copper and aluminium. The trends and need for fine pitch are considered, and even large wire attachment for power devices is addressed. A range of equipment is illustrated and a comprehensive table of suppliers and attributes is supplied. Brief descriptions of direct bonding - TAB Flip-Chip, and Beam Lead - serve as introductions to other videos available in the series. Quality assurance again requires cleanliness and machine control, while quality assessment includes pull testing and X-raying.