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Code: EP105

Description

TAB is a direct bonding technique using solid copper conductors aligned with, and bonded through special bumps to, the IC bonding pads. Early in the video the advantages (time, strength, performance, area) and disadvantages (cost) of TAB are addressed. Tape and bump construction and the sequence of operations for TAB bonding are then described and video sequences of equipment operations shown. Area Array TAB (AATAB) developments will overcome the limitations of Pad Limited ICs. Single-point TAB bonding is described and illustrated as a forward looking solution to achieve high yield and reworkability of high I/O connections. Following the descriptions, the lecture considers the technical advantages of TAB, compares them with other package types, and then examines the market opportunities, from which TAB is seen to be becoming a dominant technique for the following decade. New developments shown include those by Bull SA., jointly with British Telecom, to achieve 100 µm pitch TAB, and also Rogers working with Motorola and DEC for 356 lead TAB for the ECL MCMs for the VAX9000. Off-the-shelf TAB ICs conforming to new JEDEC standards are available from National Semiconductor (TapePAK) and Texas Instruments (TAB Pak).