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Code: EP107

Description

High Performance is seen to encompass a number of different attributes including flexibility, testability, reliability, power handling, speed, distortion, and so on. Electrical comparisons with wirebonding and TAB are made. Trends of line widths and power are then related to expected electrical performance. A practical example shows how noise and reflections can arise and be dealt with by design and technology. Lower dielectric constant technologies are also shown to enable higher packing densities with low crosstalk and higher speeds.

A case study of a development by CIMSA, Thomson CSF, is provided whereby they have used multilevel metals to interleave signal lines and power lines with ground planes in order to lower inductances and improve electrical performance, and an integral decoupling capacitor provides symmetrical common mode operation and also decreases the external I/O.

Illustrations show factors affecting crosstalk, characteristic impedance, and materials and circuit structures for high speeds. Single-chip modules are seen to be slower than multichip modules, but sometimes can have the benefit of enabling cooling. The various contributions are shown in a hierarchy which adds up eventually to system speed performance.