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Code: EP108

Description

This lecture pulls together various strands of high density interconnection (HDI) from other video lectures and puts them into context. Some original advanced results are also presented.

A definition of HDI leads on to an illustration of the trend to increase complexity while designers endeavour to reduce the I/O of particular systems. A number of multi device assembly techniques are described and compared - leaded and leadless, hermetic and non-hermetic packages, TAB and Flip Chip. Also discussed are the alternatives of substrates and track densities attainable with high and low temperature co-fired ceramics, multilayer thick-films and new developments in Selective Electroplating illustrated by some interesting new circuits. The lecture considers even higher density thin-film techniques and also Microwire. A comparison of the relative positioning of these technologies is presented in a chart of speed versus complexity