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Code: EP110

Description

Starting with the electronics need for MCMs, extended coverage is provided on a number of approaches to MCMs. A number of interconnection density charts (providing plenty of opportunity for the student to undertake some example calculations) set the scene for the place of MCMs in solving the need for high density, high yield, high performance circuits. Some technologies clearly cannot be cost justified. Definitions and choices are presented. A number of examples of applications are shown to illustrate the benefits obtained by those active in the field.

The lecturer argues against silicon substrates and develops arguments in favour of copper conductors multilayered with low dielectric organics, such as BCB, supported on a ceramic substrate. Vias are expected to move from "open" to "filled". Other substrates including Cu-In-Cu and Cu-Mo and AlN are also described and compared. The need to support high currents and transfer heat also focuses on copper and AlN. Exotic solutions are critically considered. Solutions for integrating capacitors and other passive components on the substrate and thereby gaining assembly and performance benefits are reported.

Assembly techniques come down in favour of wirebonding (for low I/O) and TAB (for high I/O) in preference to Flip Chip. Yield benefits stem from testability obtainable with TAB and also with built-in-test. Some very complicated and clumsy solutions to testability are also critically examined. Reliability considerations have also led to some very awkward solutions. Reliability through plastic "gel coatings" is positively supported as a result of the favourable findings by the IEEE "Gel Task Force" following the lead by British Telecom some 10 years earlier.

The lecture then addresses ASICs and the evident competition the companies see from MCMs. The choice of multilayer substrates is expected to settle for 6-10 layers of organic on ceramic to the disadvantage of the multilayer, 20-30 layer, PWBs. The lecture offers guidance on choices and concludes that MCMs will successfully penetrate the market.