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Code: EP117

Description

The lecture provides comprehensive coverage of the topic starting from the requirement to provide an optical alternative to the PCB to interconnect a full range of optical components for high data rate systems. The requirement is seen to favour long wavelength systems, with dimensions and tolerances down to those described in Lecture 3. The potential for photonics motherboards is seen to be huge, as electronics approaches fundamental limits. Benefits include: no EMC problems, limitless bandwidth, and lossless (i.e., fibre amplifiers). Techniques of integration of photonics and volume processing are expected to bring down costs. Interfaces include: intraboard, interboard, edge-coupled (lasers, E-LEDS, IOCs) integration, surface-coupled photodetectors, bulk optics (lenses, filters, isolators), with electronics, with electrical, and packaging to control the environment. The lecture goes on to describe choices and techniques for substrates (e.g., LiNbO3, Si, polymers), integrated waveguides (silica-on-silicon), micromachining (selective anisotropic etching, e.g., to achieve V-grooves) , and multi-chip modules (e.g., using flip-chip to provide self-alignment). Device integration deals with laser mounting, using active or passive alignment. High calibre diagrams illustrate the construction of integration of devices on the motherboard, and multi-fibre alignments in V-grooves to achieve plug connections. Examples include an optical transceiver using flip-chip multi-chip on a substrate with both electrical and optical interconnect and micromachined optical connector interface. Also described are a 8x8 Benes switch and 2D interconnection of motherboards in an equipment rack. The future outlook is for integration, micromachining, and 3D interconnect.