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Code: EP122

Description

The material is presented in two parts, comprising a lecture, followed by an interview incorporating a video sequence on moulded circuits being manufactured.

Part 1 examines the opportunities to benefit from moulded circuits by eliminating individual machining steps and eliminating drilling, thus increasing production rates, but especially to be able to take advantage of the 3D shape. Then the requirements of the plastic are identified and detailed, including: chemical resistance, continuous operating temperature, short-term (e.g., soldering) temperature exposure, and TCE. Also important are dielectric constant and electrical conductivity. A range of plastics available for moulding are listed. Styles of board include 2-D, 2-D plus non-metallised 3-D, and 3-D moulding plus interconnect. Metallisation methods include electroless plating, photosensitive electroless copper, screen-printed silver transfer, metal foil transfer. Their pros and cons are discussed, supported by a number of illustrations and examples. Benefits include: potential cost savings through reduced handling, 3-D features for downstream assembly benefits, and inclusion of connectors and heat transfer metal studs.