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Code: EP56

Description

Surface mounting of electronic components is a widespread universal technology when using solder in electronics. In this decade due to significant improvements electrically conductive adhesives have become the basis of a rapidly evolving technology. Conductive adhesives highlight the possibility of introducing cost-effective reliable and environmental production processes free of CFC and heavy metals.

Conductive adhesive technology and the trends as well as driving forces are described and examined in this report which has been compiled with contributions from specialists actually engaged in research, development and appreciation of PCBs and alternative substrates. Occupational health and environmental concerns involved in electronic production have also been investigated.

The purpose of the project described was to investigate and verify the stability of conductive adhesives for surface mounted devices (SMDs) from a wide range of conductive adhesive manufacturers with a large number of adhesive products. The adhesive variants have been carefully selected from an international market survey.

A key issue has been to uncover the market of adhesive types and their compositions, and to investigate the influence of component terminations and PCB surface types in adhesive bonding stability.