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PROCESS MONITORING & YIELD IN SURFACE MOUNT AND MIXED TECHNOLOGY

[With Statistical Process Control Capability]

Prepared by D. BOSWELL, M. WICKHAM & BOB WILLIS

 QUALITY CONTROL MANUALS

Code: EP59

Contents of this page:

Description
Acknowledgements
Table of Contents
Diskette
Video Cassette

Description

In today’s electronic manufacturing industry, control of the process is all important in achieving competitive products. If the quality level and the control procedures are not correctly introduced or a misunderstanding exists over what is acceptable and rejectable, quality control will be ineffective.

This product provides a standard system by which surface mount and mixed technology processes can be effectively monitored and improved. A set of charts is provided for use in production. They cover the key parts of the manufacturing sequence and a procedure is given for collecting defect data and automatically calculating ppm defect rate’s using standardised baselines. The data are suitable for operating SPC. The basic kit comprises Definitions of Defects; Lists of Defects and Likely Causes; Defect Recording Charts and Instructions.

Acknowledgements

Sincere thanks are extended to Bob Willis in his capacity as chairman of the SMART Group, to John McCarthy and Nick Chandler for their detailed inputs on early drafts and to other members of the Steering Committee to the Surface Mount Club for their helpful comments on the project. Martin Wickham prepared the initial drafts of the spreadsheets and thanks are due both to him and the McGraw-Hill Book Company for giving permission to reproduce the Table B1 to B11 from the book ‘Surface Mount Guidelines for Process Control, Quality and Reliability’, by David Boswell and Martin Wickham.

Table of Contents

Supplied in A4 file format with plastic encapsulated pages, for use on the bench, the kit comprises:

PART A - DEFINITIONS OF DEFECTS

PART B - TYPICAL SM DEFECTS AND THEIR LIKELY CAUSES

Screen Printing Solder Paste
Stencil Printing Solder paste
Syringe Dispensing Solder Paste
Syringe Adhesive Spotting
Manual SM Component Placement
Auto-placement of SM Components
Reflowed SM Solder Joints
Wave and Jet-soldered SM Joints
Assembled Board Cleanliness
Equivalent % and ‘Parts per million’ Defectives
 PART C - DEFECT RECORDING

Part C1: Introduction to the Charts and How to Complete them

Part C2: Recommended Recordable Defects

After Solder Paste Deposition
After Adhesive Deposition
After Component Placement
After Wave Jet Soldering
After Reflow Soldering
After Hand Placement/Soldering and Rework
After Cleaning
After In-circuit Electrical Test
 Part C3: Defect Recording
Computer Print-out of Completed Level 1 Chart with Graph - Example
Computer Print-out of Completed Level 2 Chart with Graph - Example
Manually Completed Level 1 Chart - Example

Level 1 Charts, Specific to Processes Listed in C2, plus 2 Different Blank Masters

Level 2 Charts, Specific to Processes Listed in C2, plus 2 Different Blank Masters

Level 3 Chart with Processes Listed, plus 2 Different Blank Masters

PART D

A 16 page set of visual inspection guidelines for component and joint types, with drawings and limits.

As separate products, but linked to the system, Technical Reference Publications also provide:

PART E (EP61)

A diskette containing all the charts in Lotus 123 for windows 1.1 format that automatically generates both the defect rates in parts per million (ppm) and their graphical presentation. The format enables direct linkage to a central data monitoring and storage system.

PART F (EP60)

A video cassette for training workforce members. It shows how to complete the charts.

 

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© Electrochemical Publications, IOM, 1997-2005

 Page last revised 11.02.05

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