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Code: EP87

Description

A guide to the use of x-ray inspection for solder joint quality control and the typical defects which may be found. Includes an example of standards and A4 test sheets.

• Basic X-ray Inspection

• Equipment Requirements

• Solder Joint Standards

• X-ray Criteria

• Chip Components

• Fine Pitch Joints

• Ball Grid Array

• Process Defects

• Assessment Exercise