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ENVIRONMENTAL IMPACT OF ADHESIVES AND SOLDERS

by H. Westphal, I. R. Nielsen and H. L. Hvims

REPORTS

Code: EP58

Contents of this page:

Description
Table of Contents

Description

Life cycle analysis and environmental characteristics of conductive adhesives versus soldering. Electrical and mechanical test results of potential conductive adhesives for surface mount technology.

Table of Contents

1. INTRODUCTION

2. ADHESION VERSUS SOLDERING

3. CHOICE OF METHOD

3.1 Quantity analysis

3.2 Environmental assessment

3.2.1 Product information

3.2.2 Substance profiles

3.2.3 Life cycle screening

4. EXTENT OF PROBLEM - QUANTITY ANALYSES

4.1 Supplies of solder materials

4.2 Quantity analysis

4.3 Substitution potential

5. CHARACTERISATION OF JOINING MATERIAL

5.1 Chemical composition of conductive adhesives in general

5.2 Solder materials

5.3 Comparison of adhesives and of solder

6. ENVIRONMENTAL CHARACTERISTICS OF ADHESIVES AND OF SOLDER MATERIAL

6.1 Environmental impact of conductive adhesives

6.1.1 Metals

6.1.2 Organic solvents

6.1.3 Epoxy

6.1.4 Amines

6.1.5 Cleaning agents

6.1.6 Summary of environmental impact by the use of conductive adhesives

6.1.7 Environmental impact from solder materials

7. LIFE CYCLE SCREENING OF SOLDERING VERSUS ADHESION

7.1 Limitation

7.1.1 Where and when is the result to be used?

7.1.2 Alternatives

7.1.3 Process trees

7.1.4 Environmental parameters

7.1.5 Irregularities and accidents

7.1.6 Allocations

7.1.7 Assessment method

7.2 ENVIRONMENTAL LOAD IN THE LIFE CYCLE OF THE TWO ALTERNATIVES

7.2.1 Manufacture of joining material

7.2.2 Manufacture of components

7.2.3 Manufacture of printed circuit boards

7.2.4 production of mobile phones

7.2.5 Use

7.2.6 Disposal

7.3 CONCLUSIONS

REFERENCES

CERTIFICATION

1. SCOPE

2. APPLICABLE DOCUMENTS

3. TEST SAMPLES AND PREPARATION

4. SURVEY OF COMPONENTS TESTED

5. COMPONENT TYPES FOR ELECTRICAL TESTS

6. COMPONENT TYPES FOR MECHANICAL TEST

7. TEST PLAN FOR EFFECTS OF CONDUCTIVE ADHESIVE PROPERTIES ON BONDING STABILITY "THE DELTA METHOD"

7.1 Flow chart

7.2 Test circuit

7.3 PCB layout, solder mask

7.4 Surface finish of test circuit

7.5 Cleaning base material

7.6 Stencil printing

7.7 Component mounting

7.8 Curing times and temperatures

7.9 Cleaning of mounted PCBs

7.10 Electrical measurements

7.11 Temperature cycling

7.12 Damp heat, steady state

7.13 Adhesion test

8. DESCRIPTION OF DIAGRAM FOR PRESENTATION OF ELECTRICAL TEST RESULTS

8.1 General

8.2 Layout for absolute measuring results

9. ELECTRICAL TEST RESULTS

9.1 General

9.2 Electrical measuring/resistance change

10. ADHESION TEST RESULTS

 

 

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 Page last revised 11.02.05

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