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PROFESSIONAL SMT COMPONENT AND LAND PATTERN BOOK 1996 7TH EDITION

by James C. Blankenhorn

ISBN: 1-8828 12-05-0

"The most Comprehensive and Extensively Used Library on the Market today!"

 REFERENCE BOOKS

Code: EP47

Contents of this page:

Description
Table of Contents

Description

This reference book is a new concept that offers both the critical package information and the correct land pattern for the part on a single page.

This easy to use book is a compilation of over 700 dimensioned packages and associated land patterns in 40 sections.

Serious designers will find that the Professional SMT Component and Land Pattern Book is a valuable resource for successfully designing SMT.

Table of Contents

Section 1 - Narrow Body SOIC

Section 2 - Medium Body SOIC

Section 3 - Wide Body SOIC

Section 4 - Metric Body SOIC

Section 5 - SOJ

Section 6 - PLCC

Section 7 - Ceramic Flat Package

Section 8 - Leadless Carriers

Section 9 - Flat Packages

Section 10 - QFP (Quad Flat Pack)

Section 11 - Ceramic Chips

Section 12 - Tantalum Capacitors

Section 13 - Melf Components

 Section 14 - Chip Inductors

Section 15 - Diode/Transistors

Section 16 - Military Chips

Section 17 - Bump QFP

Section 18 - VSO

Section 19 - Connector/Headers

Section 20 - Electrolytics

Section 21 - Trimmers

Section 22 - JLCC

Section 23 - Crystal/Osc.

Section 24 - TAB

Section 25 - Sockets

Section 26 - Wave Patterns

 Section 27 - Relays

Section 28 - LEDs

Section 29 - Switches

Section 30 - Hi Density Patters

Section 31 - TSOP/TSSOP

Section 32 - Resistor Networks

Section 33 - Butt Mounts

Section 34 - Ceramic LCC

Section 35 - Ceramic QFP

Section 36 - PQFP in MRC

Section 37 - BGA

Section 38 - PSOP/QSOP/SSOP

Section 39 - Thin QFP

Section 40 - QFJ

 

 

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 Page last revised 11.02.05

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