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Code: EP51
* Formerly BGA, COB & FLIP CHIP PCB DESIGN

Contents of this page:

Description
Table of Contents

Description

New products are pushing density and speed to the limits. To support this evolution packaging technologies are moving at a rapid pace. Designers are trying to keep up and find information that can help in implementing these new technologies. Finding this information can be very difficult. ‘BGA, COB and Flip Chip PCB Design’ was written to provide such information.

Integrating new packaging technologies into products is a real challenge. The most successful advanced designs are when design, test, and assembly have all worked together. Using advanced packaging technology is optimised when all the departments work together, and the design of the package is undertaken in concert with the PCB design.

This new publication provides information on COB, Flip Chip, MCM TAB, BGA, CSP and other packaging technologies. There is lots of information here on how to make the land patterns, determine the number of layers needed, optimising placement, evaluating the routing, via placements, setting up PCB specs and lots more. For those who have not used wire bonding before there is information that helps you understand the terms and needs of the evolving wire bonding technology.

BGA packages are being used more all the time. With BGA packages there are many issues that need to be understood and are addressed in this book. First, there are several types of BGA packages (including plastic and ceramic) using an assortment of lead structures that have unique requirements. Additional items such as manufacturing needs, testing, trace routing, via location,  thermal, repair/rework and more, is also included.

Table of Contents