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TROUBLESHOOTING

The Surface Mount and Fine Pitch Technology Process

by Charles I. Hutchins, PhD

Pages--100+viii; Tables--13; Figures--47; Size--28 x 23 cm.

 REFERENCE BOOKS

Code: EP145

Contents of this page:

Description
About the author
Table of Contents

Description

This book was written to enhance one’s ability to understand workmanship standards, troubleshooting techniques, and cause-and-effect relationships. The first chapter provides an overview of the major component families and some of the issues that are important for finding and preventing problems. Following that chapter, there are successive chapters on printed circuit boards (PCB), manufacturing process flows and details, test, and inspection. Next, there are chapters discussing the details of workmanship guidelines and troubleshooting methods. The last chapter includes both SPC methods and useful information in an "artificial intelligence or expert system" format. This book summarises the important points which helps one to understand how to facilitate troubleshooting in a methodical and successful manner.

Troubleshooting in the context of this book means more than just "finding and fixing" defects. It also means the prevention of defects, as it is well known that rework/repair processes, even performed with the best of equipment and procedures, introduces some reliability risk. Also, troubleshooting means reducing cost and operating more efficiently, so many tips are included to achieve a better product at lower cost.

This book is written at the intermediate or advanced level

About the author

Dr. Charles Huchins is an independent consultant recognised world-wide for his expertise in Surface Mount Technology. His experience includes 22 years at Texas Instruments Inc., where he served in capacities such as Engineering Manager, Quality Department Manager, and Product Manager. The last three years of his TI experience, Dr. Hutchins was responsible for engineering management at TI’s SMT Center, specifically process engineering, SPC implementation, yield improvement, product design and development, and the Customer Training Program. Since leaving TI, he has worked several years as a technical and managerial consultant for many companies and conducted numerous SMT/FPT training sessions.

Dr. Hutchins is also the author of "Understanding and Using Surface Mount and Fine Pitch Technology", as well as many technical papers and manufacturing articles. He has served as the President (1991-1992) and Vice President of Technical Programs (1989) of the Surface Mount Technology Association. He presently serves on the Editorial Advisory Board and writes a monthly column on current issues in SMT Manufacturing for Surface Mount Technology Magazine.

Dr. Hutchins holds PhD and MS Degrees in Electrical Engineering from North Carolina State University. He is a member of SMTA, IMAPS, and IEEE.

Table of Contents

CHAPTER ONE

1 Surface Mount Components

1.1 Leadless Passive Components

1.2 Leadless Active Components

1.2.1 Leadless Ceramic Chip Carriers

1.2.2 Ball Grid Array Packages

1.3 Leaded Plastic Components

1.4 Fine Pitch and Ultra-Fine Pitch Technology

1.4.1 Definitions

1.4.2 QFP/PQFP Packages

1.5 Package Summary

1.6 Component Requirements

1.6.1 Standards

1.6.2 Planarity and Solderability

1.6.3 Handling Considerations

1.7 Component Procurement Requirements

CHAPTER TWO

2 Printed Circuit Boards

2.1 Solderability

2.2 Planarity

2.3 Solder Mask

2.4 Vias

2.5 Standards

2.6 PCB Procurement Requirements

CHAPTER THREE

3 Surface Mount Process Flows

3.1 Types of process flows

3.2 Type I

3.3 Type II

3.4 Type III

 CHAPTER FOUR

4 Manufacturing Process

4.1 Printing Solder Paste

4.1.1 Paste

4.1.2 Stencils

4.1.3 Equipment

4.2 Component Placement

4.2.1 Geometry Control

4.2.2 Component Feeders

4.3 Reflow

4.3.1 The Dynamics of the Reflow Process

4.3.2 Soldering Profile Requirements

4.3.3 Reflow Methods

4.3.3.1 Forced Hot Air Convection

4.3.3.2 Infrared Soldering

4.3.3.3 Vapor Phase Soldering

4.4 Clean-up

4.4.1 Batch

4.4.2 In-Line

4.5 Yield Losses

4.5.1 Components

4.5.2 Printed Circuit Boards

4.5.3 Equipment

4.5.4 Process

4.6 Process Studies

4.6.1 Daisy Chain Units

4.6.2 Test Boards

CHAPTER FIVE

5 Inspection and Test

5.1 Inspection Needs

5.1.1 Lead Planarity

5.1.2 Solder Paste Volume

5.1.3 Placement Verification

5.1.4 Solder Joints

 5.2 Inspection Techniques

5.2.1 Visual

5.2.2 Machine Optical

5.2.3 X-Ray

5.2.4 Comparison of Inspection Techniques

5.3 Electrical Test

5.3.1 Functional Test

5.3.2 Bottom Side Probing

5.3.3 Both side Probing

CHAPTER SIX

6 Guidelines for Workmanship Standards

6.1 The Need for Standards

6.2 Identifying Failure Modes

6.3 Measurement Accuracy

6.4 Thermal Process History

6.5 Standards Application

6.5.1 Solder Paste Printing

6.5.2 Adhesive Dispensing/Printing

6.5.3 Component Placement

6.5.4 Post Soldering Inspection

6.5.5 Ball Grid Array

6.5.6 Other Visual and Electrical

CHAPTER SEVEN

7 Troubleshooting Methods

7.1 Necessity for Troubleshooting

7.2 Statistical Methods

7.2.1 Control Charts

7.2.2 Variables Data

7.2.3 Attributes Data

7.2.4 Analysis for Corrective Action

7.3 SPC Points For SMT

7.4 Implementing an SPC Program

7.5 Troubleshooting Via Artificial Intelligence

7.6 Corrective Action and Follow-up

 

 

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 Page last revised 11.02.05

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