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Code: EP126

Description

This CD-ROM is the first in a series which will provide a guide to common process defects found at each stage of the SMT process. It also includes defects specific to printed boards and components. At the first screen you select the process you want to view which gives you an introduction to one of the processes listed below.

Printed Boards, Components (inc.) BGA, Screen Print, Adhesive Application, Placement, Reflow Solder, Wave Solder, Cleaning, Rework. The printed board section explains the most important issues associated with surface mount circuits. It then lists common process defects which can be selected to reveal a photographic example of the defect type and an explanation of the possible causes.